Intel corporation (20240332237). MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER simplified abstract
Contents
MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER
Organization Name
Inventor(s)
Vivek Chidambaram of Singapore (SG)
Jonathan Burk of Portland OR (US)
Zhihua Zou of Chandler AZ (US)
MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332237 titled 'MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER
The abstract describes microelectronic assemblies utilizing nanotwinned copper for direct bonding between components.
- Direct bonding regions in the assembly have different microstructures in two portions.
- The first portion lacks columnar microstructure, while the second portion has columnar microstructure.
- Less than 40% of grains in the first portion have a <111> orientation, while at least 50% of grains in the second portion have <111> orientation.
- The first portion may consist of PCC or FGC, while the second portion includes NTC.
- Potential Applications:**
- Advanced microelectronic devices - High-performance electronic components - Semiconductor industry
- Problems Solved:**
- Enhanced bonding strength between microelectronic components - Improved reliability and durability of microelectronic assemblies
- Benefits:**
- Increased efficiency in microelectronic device performance - Greater stability and longevity of electronic components - Potential for miniaturization and higher integration levels
- Commercial Applications:**
Title: "Innovative Microelectronic Assemblies with Nanotwinned Copper for Enhanced Performance" This technology could revolutionize the semiconductor industry by providing more reliable and durable microelectronic assemblies, leading to higher-performing electronic devices with increased efficiency and stability. The market implications include the potential for developing cutting-edge electronic products with enhanced capabilities.
- Questions about Microelectronic Assemblies with Nanotwinned Copper:**
1. How does the use of nanotwinned copper improve the direct bonding between microelectronic components? 2. What are the specific advantages of having different microstructures in the direct bonding region of the assembly?
Original Abstract Submitted
disclosed herein are microelectronic assemblies with direct bonding using nanotwinned copper (ntc). an example microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding (db) region, wherein the db region includes a db contact comprising a first portion and a second portion having different microstructures. the first portion is between the first microelectronic component and the second portion. the second portion is between the first portion and the second microelectronic component. in some implementations, the first portion has non-columnar microstructure, and the second portion has columnar microstructure. in some implementations, less than about 40% of grains of the first portion have ac <111> orientation, and at least about 50% of grains of the second portion have the <111> orientation. in some embodiments, the first portion includes pcc or fgc, and the second portion includes ntc.
