Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

Organization Name

intel corporation

Inventor(s)

Robert Alan May of Chandler AZ (US)

Islam A. Salama of Chandler AZ (US)

Sri Ranga Sai Boyapati of Chandler AZ (US)

Sheng Li of Gilbert AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Robert L. Sankman of Phoenix AZ (US)

Amruthavalli Pallavi Alur of Tempe AZ (US)

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240332203 titled 'MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

The abstract of the patent application describes a microelectronic device that includes an embedded die substrate on an interposer, with the embedded die substrate having only a single layer of transverse routing traces. Additional routing is allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate is formed with a planarized dielectric over an initial metallization layer supporting the embedded die.

• Embedded die substrate with a single layer of transverse routing traces
• Additional routing allocated to the interposer
• Planarized dielectric over initial metallization layer supporting the embedded die

Potential Applications: - Microelectronic devices - Semiconductor industry - Integrated circuits

Problems Solved: - Efficient routing of traces in microelectronic devices - Improved performance and reliability of embedded die substrates

Benefits: - Enhanced functionality of microelectronic devices - Simplified manufacturing process - Increased durability and longevity of embedded die substrates

Commercial Applications: Title: Advanced Microelectronic Devices with Embedded Die Substrates This technology can be utilized in various commercial applications such as mobile devices, computers, automotive electronics, and IoT devices. The market implications include improved product performance, reduced manufacturing costs, and increased competitiveness in the semiconductor industry.

Prior Art: Researchers can explore prior art related to embedded die substrates, interposer technology, and microelectronic device design to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research: Researchers and industry professionals can stay updated on the latest advancements in embedded die substrate technology, interposer design, and microelectronic device manufacturing processes to enhance their knowledge and expertise in this field.

Questions about Embedded Die Substrates: 1. How does the single layer of transverse routing traces in the embedded die substrate impact the overall performance of the microelectronic device? 2. What are the key differences between traditional routing methods and the routing allocation to the interposer in this innovative design?

Original Abstract Submitted

a microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. in the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. the embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.