Intel corporation (20240332195). SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES simplified abstract
SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES
Organization Name
Inventor(s)
Naiya Soetan-dodd of Mesa AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Sheng C. Li of Gilbert AZ (US)
Liwei Cheng of Chandler AZ (US)
SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332195 titled 'SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES
The abstract of this patent application describes an electronic package that includes a core made of glass, with a cavity in the core containing a bridge made of through substrate vias (TSVs) and pads at the bottom of the cavity electrically coupled to the TSVs.
- Simplified Explanation: The patent application discusses an electronic package with a glass core, a cavity with a bridge made of TSVs, and pads at the bottom of the cavity.
- Key Features and Innovation:
- Electronic package with a glass core - Bridge made of TSVs in a cavity - Pads electrically coupled to the TSVs
- Potential Applications:
- Semiconductor packaging - Microelectronics - Integrated circuits
- Problems Solved:
- Enhancing electrical connectivity in electronic packages - Improving the structural integrity of the package
- Benefits:
- Increased reliability - Enhanced performance - Cost-effective manufacturing
- Commercial Applications:
- Semiconductor industry - Electronics manufacturing - Telecommunications sector
- Prior Art:
- Prior research on glass core electronic packages - Studies on TSVs in microelectronics
- Frequently Updated Research:
- Ongoing developments in glass core electronic packaging - Advancements in TSV technology
Questions about Glass Core Electronic Package: 1. What are the main advantages of using a glass core in electronic packaging? 2. How do TSVs improve the performance of electronic packages?
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Original Abstract Submitted
embodiments disclosed herein include an electronic package. in an embodiment, the electronic package comprises a core, where the core comprises glass. in an embodiment, a cavity is in the core, and a bridge is in the cavity. in an embodiment, the bridge comprises through substrate vias (tsvs). in an embodiment, pads are at a bottom of the cavity, where the tsvs are electrically coupled to the pads.
