Intel corporation (20240332153). DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION simplified abstract
Contents
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
Organization Name
Inventor(s)
Tchefor Ndukum of Chandler AZ (US)
Yonggang Li of Chandler AZ (US)
Rengarajan Shanmugam of Tempe AZ (US)
Darko Grujicic of Chandler AZ (US)
Deniz Turan of Chandler AZ (US)
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332153 titled 'DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
The abstract of this patent application describes electronic packages with a substrate, a sloped seed layer, and an electrically conductive feature.
- Sloped sidewalls of the seed layer
- Electrically conductive feature over the seed layer
- Potential Applications:**
- Semiconductor packaging - Microelectronics - Integrated circuits
- Problems Solved:**
- Improved electrical conductivity - Enhanced performance of electronic components
- Benefits:**
- Increased efficiency - Better signal transmission - Reduced interference
- Commercial Applications:**
- Electronics manufacturing industry - Semiconductor companies - Technology research and development firms
- Questions about Electronic Packages:**
1. How do sloped sidewalls of the seed layer impact the performance of electronic packages? 2. What are the advantages of having an electrically conductive feature over the seed layer?
- Frequently Updated Research:**
- Ongoing studies on optimizing seed layer design for electronic packages.
Original Abstract Submitted
embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a substrate and a seed layer over the substrate. in an embodiment, sidewalls of the seed layer are sloped. in an embodiment, the electronic package further comprises a feature over the seed layer, where the feature is electrically conductive.
