Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract
Contents
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES
Organization Name
Inventor(s)
Jung Kyu Han of Chandler AZ (US)
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332134 titled 'METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES
The abstract of this patent application describes methods and apparatus to mitigate electromigration in an integrated circuit package. The package includes a dielectric substrate, a contact pad with copper, and a metal interconnect with indium.
- Copper contact pad and indium metal interconnect are used in the integrated circuit package to mitigate electromigration.
- The dielectric substrate provides a foundation for the components in the package.
- Electromigration is a common issue in integrated circuits that can lead to device failure.
- The use of copper and indium helps improve the reliability and longevity of the integrated circuit.
- This innovation aims to enhance the performance and durability of electronic devices.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Circuit design and development
Problems Solved: - Electromigration in integrated circuits - Reliability and longevity of electronic devices
Benefits: - Improved performance and durability of integrated circuits - Enhanced reliability of electronic devices - Longer lifespan of electronic components
Commercial Applications: Title: Enhanced Reliability in Semiconductor Manufacturing This technology can be applied in the production of various electronic devices, such as smartphones, computers, and automotive electronics. It can help manufacturers improve the quality and longevity of their products, leading to increased customer satisfaction and brand loyalty.
Questions about Electromigration Mitigation: 1. How does electromigration impact the performance of integrated circuits? Electromigration can cause metal atoms to move along the conductive paths in an integrated circuit, leading to device failure over time. 2. What are the key differences between copper and indium in terms of mitigating electromigration? Copper is a common material used in contact pads due to its high conductivity, while indium is known for its resistance to electromigration, making it a suitable choice for metal interconnects in this application.
Original Abstract Submitted
methods and apparatus to mitigate electromigration are disclosed. a disclosed example integrated circuit (ic) package includes a dielectric substrate, a contact pad at least partially extending though or positioned on the dielectric substrate, the contact pad including copper, and a metal interconnect coupled to the contact pad, the interconnect including indium.
