Intel corporation (20240332116). SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD simplified abstract
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SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
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SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332116 titled 'SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
The abstract of the patent application describes an electronic device with a thermal interface material between a heat spreader and a semiconductor die. In some cases, the thermal interface material includes liquid metal, and the heat spreader has a top opening to introduce the material between the die and the heat spreader.
- Simplified Explanation:
- Electronic device with thermal interface material between heat spreader and semiconductor die. - Thermal interface material may include liquid metal. - Heat spreader has top opening to introduce material between die and spreader.
- Key Features and Innovation:
- Use of liquid metal in thermal interface material. - Top opening in heat spreader for easy introduction of material.
- Potential Applications:
- Improved heat dissipation in electronic devices. - Enhanced thermal management in high-performance computing systems.
- Problems Solved:
- Addressing heat dissipation challenges in electronic devices. - Improving overall performance and reliability of semiconductor components.
- Benefits:
- Increased efficiency in heat transfer. - Extended lifespan of electronic devices. - Enhanced overall performance of electronic systems.
- Commercial Applications:
- Potential applications in consumer electronics, data centers, and industrial machinery. - Market implications include improved product performance and reliability.
- Questions about Thermal Interface Material:
1. How does the use of liquid metal in the thermal interface material improve heat dissipation? 2. What are the advantages of having a top opening in the heat spreader for introducing the material?
- Frequently Updated Research:
- Ongoing research on new materials for thermal interface applications. - Studies on the impact of thermal management on electronic device performance.
Original Abstract Submitted
an electronic device and associated methods are disclosed. in one example, the electronic device includes a thermal interface material between a heat spreader and a semiconductor die. in selected examples, the thermal interface material includes a liquid metal, and the heat spreader includes a top opening that is used to introduce the thermal interface material to a space between the die and the heat spreader.
