Intel corporation (20240329339). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS simplified abstract
Contents
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Changhua Liu of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240329339 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS
The abstract of this patent application describes a microelectronic assembly that includes a photonic integrated circuit (PIC) with magnetic materials, a fiber connector with magnetic materials, and a fiber physically coupled to the fiber connector through an adhesive material, with the fiber positioned in a channel on the PIC.
- Key Features and Innovation:
- Microelectronic assembly with a PIC and magnetic materials for coupling
- Use of a fiber connector with magnetic materials for alignment
- Adhesive material for physical coupling of the fiber to the fiber connector
- Precise positioning of the fiber in the channel on the PIC
- Potential Applications:
- Telecommunications industry for high-speed data transmission
- Data centers for efficient connectivity
- Optical networking for improved performance
- Problems Solved:
- Precise alignment and coupling of optical fibers in microelectronic assemblies
- Enhanced data transmission speeds and reliability
- Benefits:
- Improved signal integrity and reduced signal loss
- Enhanced data transfer rates
- Simplified assembly process
- Commercial Applications:
- High-speed data transmission equipment
- Optical networking devices
- Telecommunication infrastructure
- Frequently Updated Research:
- Ongoing research on improving the efficiency and performance of microelectronic assemblies with photonic integrated circuits and fiber connectors
Questions about Microelectronic Assemblies:
1. How does the use of magnetic materials in the assembly improve alignment and coupling? 2. What are the potential challenges in scaling up this technology for mass production?
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Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a photonic integrated circuit (pic) having a first surface having a channel and a first magnetic material; a fiber connector including a second surface with a second magnetic material; and a fiber physically coupled to the second surface of the fiber connector by an adhesive material; wherein the first surface of the pic is coupled to the second surface of the fiber connector by the first and second magnetic materials with the fiber positioned in the channel.
