Intel corporation (20240329333). CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE simplified abstract

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

Organization Name

intel corporation

Inventor(s)

Robert May of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Changhua Liu of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Lilia May of Chandler AZ (US)

Shriya Seshadri of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Tarek Ibrahim of Mesa AZ (US)

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240329333 titled 'CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

The patent application describes multi-die packages that combine photonic and electric integrated circuit (IC) dies interconnected through a routing structure on a glass substrate. An optical waveguide in a glass preform may also be attached to the routing structure. Electrical IC (EIC) dies and photonic IC (PIC) dies are arrayed over the routing structure, with each PIC coupled to an optical waveguide in the glass preform. Conductive vias extend through the glass substrate to connect with a host substrate, which may also contain an optical waveguide. A vertical coupler is attached to the host substrate to optically couple it to the optical waveguide in the glass preform.

• Glass substrate with routing structure
• Integration of photonic and electric IC dies
• Optical waveguide in glass preform
• Array of EIC and PIC dies
• Conductive vias for connectivity
• Host substrate with embedded optical waveguide
• Vertical coupler for optical coupling

• • Potential Applications:**

- Data centers - Telecommunications - Optical networking - High-speed computing - Medical devices

• • Problems Solved:**

- Enhanced data transfer speeds - Improved signal integrity - Space-saving design - Integration of different technologies - Optimal use of optical components

• • Benefits:**

- Increased performance - Higher bandwidth capabilities - Reduced latency - Compact and efficient design - Scalability for future advancements

• • Commercial Applications:**

Title: "Integrated Photonic and Electric Multi-Die Packages for Advanced Data Processing" This technology can revolutionize data processing in various industries, including telecommunications, data centers, and high-performance computing. The compact and efficient design offers improved performance and scalability, making it ideal for applications requiring high-speed data transfer and signal integrity.

• • Questions about the Technology:**

1. How does the integration of photonic and electric IC dies improve data processing efficiency? 2. What are the potential challenges in scaling this technology for mass production?

Original Abstract Submitted

multi-die packages including both photonic and electric integrated circuit (ic) die interconnected to each other through a routing structure built-up on a glass substrate. a glass preform comprising an optical waveguide may also be attached to the routing structure. a plurality of electrical ic (eic) die may be arrayed over the routing structure along with a plurality of photonic ic (pic). each pic may be coupled to an optical waveguide within the glass preform. conductive vias may extend through the glass substrate and be further coupled with a host substrate. the host substrate may comprise glass and an optical waveguide embedded within the glass. a vertical coupler may be attached to the host substrate to optically couple the host substrate to the optical waveguide within the glass preform of the multi-die package. many of the multi-die packages may be arrayed over a routing structure on the host substrate.