Intel corporation (20240329313). TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES simplified abstract

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TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES

Organization Name

intel corporation

Inventor(s)

Chia-Pin Chiu of Tempe AZ (US)

Kaveh Hosseini of Livermore CA (US)

Xiaoqian Li of Chandler AZ (US)

TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240329313 titled 'TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES

Simplified Explanation: The patent application describes technologies for optical coupling to photonic integrated circuit (PIC) dies using a lens array to collimate light from waveguides on the PIC die.

  • Light from waveguides on the PIC die reflects off a reflective surface on the lens array.
  • The reflective surface directs the light towards lenses in the lens array, which collimate the light.
  • This facilitates the coupling of light to and from other components, allowing for efficient optical communication.

Key Features and Innovation:

  • Use of a lens array to collimate light from waveguides on a PIC die.
  • Reflective surface on the lens array to direct light towards lenses for efficient coupling.
  • Ability to orient the reflective surface at different angles for flexibility in light beam orientation.

Potential Applications:

  • Optical communication systems
  • Data transmission in high-speed networks
  • Sensing and measurement devices

Problems Solved:

  • Efficient coupling of light to and from photonic integrated circuit dies
  • Flexibility in light beam orientation for different applications

Benefits:

  • Improved optical communication efficiency
  • Enhanced performance of photonic integrated circuits
  • Flexibility in light beam orientation for diverse applications

Commercial Applications: Optical communication systems for data centers, telecommunications networks, and high-speed computing applications.

Questions about Optical Coupling to Photonic Integrated Circuit (PIC) Dies: 1. How does the lens array collimate light from the waveguides on the PIC die? 2. What are the potential advantages of using a reflective surface on the lens array for directing light towards the lenses?

Frequently Updated Research: Ongoing research in the field of photonic integrated circuits and optical communication systems may provide further advancements in optical coupling technologies.


Original Abstract Submitted

technologies for optical coupling to photonic integrated circuit (pic) dies are disclosed. in one illustrative embodiment, a pic die has one or more waveguides. a lens array is positioned adjacent the pic die. light from waveguides of the pic die reflects off of a reflective surface of the lens array. the reflective surface directs the light from the pic die towards lenses in the lens array. the lenses collimate the light, facilitating coupling of light to and from other components. the reflective surface on the lens array may be oriented at any suitable angle, resulting in a collimated beam of light that is oriented at any suitable angle.

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