Intel corporation (20240328512). METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT simplified abstract

METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT

Organization Name

intel corporation

Inventor(s)

Craig Yost of Gilbert AZ (US)

Paul Jonathan Diglio of Gaston OR (US)

Ruben Eduardo Nunez Blanco of Gilbert AZ (US)

METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240328512 titled 'METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT

The abstract of this patent application describes methods, apparatus, systems, and articles of manufacture that aim to reduce leakage of a cooling fluid used to cool an electronic component.

• A seal assembly is disclosed, which includes a socket to receive an electronic component, a semiconductor die, and a substrate to support the die.
• The seal assembly comprises a first seal that surrounds the die and a second seal that surrounds the first seal, both forced against the electronic component to prevent leakage of the cooling fluid.

Key Features and Innovation:

• The seal assembly prevents leakage of cooling fluid, enhancing the efficiency of cooling electronic components.
• By surrounding the die with multiple seals, the risk of leakage is minimized, ensuring optimal performance of the electronic component.

Potential Applications:

• This technology can be applied in various electronic devices such as computers, servers, and mobile devices to improve cooling efficiency.

Problems Solved:

• Addresses the issue of cooling fluid leakage that can impact the performance and longevity of electronic components.

Benefits:

• Improved cooling efficiency leads to enhanced performance and reliability of electronic devices.
• Minimized risk of leakage reduces maintenance costs and prolongs the lifespan of electronic components.

Commercial Applications:

• This technology has potential commercial applications in the electronics industry, particularly in the manufacturing of high-performance electronic devices.

Questions about the technology: 1. How does the seal assembly prevent leakage of the cooling fluid? 2. What are the potential implications of using this technology in consumer electronics?

Frequently Updated Research: There may be ongoing research in the field of electronic component cooling and sealing techniques that could further enhance the effectiveness of this technology.

Original Abstract Submitted

methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. an example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.