Nvidia corporation (20240332223). Chip Die Substrate with Edge-Mounted Capacitors simplified abstract
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Chip Die Substrate with Edge-Mounted Capacitors
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Chip Die Substrate with Edge-Mounted Capacitors - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332223 titled 'Chip Die Substrate with Edge-Mounted Capacitors
The patent application describes an integrated circuit die substrate with capacitors attached to an edge surface of the substrate, along with other components such as conductive edge terminals and a die mounting area.
- The substrate has a top surface and a bottom surface, each with specific functions like die mounting and system interconnect terminals.
- A pair of conductive edge terminals is located on the substrate edge surface, connected to substrate conductors.
- Capacitors are attached to the substrate edge surface, with terminals electrically coupled to the edge terminals.
- An integrated circuit die is mounted on the die mounting area of the substrate.
Potential Applications: - This technology can be used in various electronic devices requiring integrated circuits with capacitors for improved performance. - It can be applied in industries such as telecommunications, computing, and consumer electronics.
Problems Solved: - Provides a compact and efficient way to integrate capacitors into integrated circuit designs. - Simplifies the manufacturing process by incorporating capacitors directly onto the substrate.
Benefits: - Enhanced performance and reliability of integrated circuits. - Cost-effective production of electronic devices with improved functionality.
Commercial Applications: Title: Innovative Integrated Circuit Substrate Technology for Enhanced Performance This technology can be utilized in the development of advanced electronic devices, leading to improved performance and reliability. The market implications include increased demand for high-quality integrated circuits in various industries.
Prior Art: Readers can explore prior patents related to integrated circuit substrates, capacitors, and electronic component integration to understand the existing technology landscape.
Frequently Updated Research: Stay informed about the latest advancements in integrated circuit design, substrate technology, and capacitor integration for cutting-edge electronic devices.
Questions about Integrated Circuit Substrate Technology: 1. How does this technology improve the efficiency of integrated circuits? - This technology enhances the performance of integrated circuits by integrating capacitors directly onto the substrate, reducing space and improving signal integrity.
2. What are the potential cost savings associated with using this innovative substrate technology? - By streamlining the manufacturing process and reducing the need for additional components, this technology can lead to cost savings in the production of electronic devices.
Original Abstract Submitted
an integrated circuit die substrate has one or more capacitors attached to an edge surface of the substrate. the substrate has a top surface and a bottom surface, at least one of which includes a die mounting area, and at least one of which includes system interconnect terminals. a substrate edge surface is disposed along a peripheral end of the substrate and is oriented substantially orthogonally to the top and bottom surfaces. a pair of conductive edge terminals is disposed on the substrate edge surface. each of the edge terminals is electrically coupled to a respective substrate conductor disposed on or inside the substrate. a capacitor is attached exteriorly to the substrate at the substrate edge surface such that terminals of the capacitor are electrically coupled to respective ones of the edge terminals. an integrated circuit die is attached at the die mounting area.
