Meta platforms technologies, llc (20240332275). 3D INTEGRATED IN-PACKAGE MAIN MEMORY simplified abstract

3D INTEGRATED IN-PACKAGE MAIN MEMORY

Organization Name

meta platforms technologies, llc

Inventor(s)

Jaesik Lee of San Jose CA (US)

Rajendra D Pendse of Fremont CA (US)

3D INTEGRATED IN-PACKAGE MAIN MEMORY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240332275 titled '3D INTEGRATED IN-PACKAGE MAIN MEMORY

The abstract of the patent application describes a multi-chiplet assembly consisting of a logic chiplet and a memory chiplet electrically coupled to each other, each with its own active frontside containing different active circuitry.

• The logic chiplet has first active circuitry on its active frontside, while the memory chiplet has second active circuitry on its active frontside.
• The active frontside of the logic chiplet faces a first direction, while the active frontside of the memory chiplet faces a second direction opposite to the first direction.

Potential Applications: - This technology can be used in the development of advanced computing systems. - It can be applied in high-performance computing applications where multiple chiplets need to work together efficiently.

Problems Solved: - Enables the integration of different chiplets with specific functionalities into a single assembly. - Facilitates the communication and coordination between various chiplets within a system.

Benefits: - Improved performance and efficiency in computing systems. - Enhanced flexibility in designing and customizing multi-chiplet assemblies for specific applications.

Commercial Applications: Title: Advanced Multi-Chiplet Assemblies for High-Performance Computing This technology can be utilized in data centers, supercomputers, and other high-performance computing environments to enhance processing power and optimize system performance.

Questions about Multi-Chiplet Assemblies: 1. How does the orientation of the active frontside of each chiplet impact the overall functionality of the multi-chiplet assembly? - The orientation of the active frontside allows for efficient communication and coordination between the logic and memory chiplets, optimizing their performance within the assembly.

2. What are the key considerations in designing multi-chiplet assemblies for specific computing applications? - Design considerations include the selection of chiplets with compatible functionalities, efficient interconnection methods, and thermal management strategies to ensure optimal performance.

Original Abstract Submitted

a multi-chiplet assembly may include a logic chiplet with an active frontside having first active circuitry. a multi-chiplet assembly may include a memory chiplet, electrically coupled to the logic chiplet, with an active frontside having second active circuitry. the active frontside of the logic chiplet may face a first direction, and the active frontside of the memory chiplet may face a second direction opposite the first direction. various other apparatuses, systems, and methods are also disclosed.