Meta platforms technologies, llc (20240332252). HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING simplified abstract

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

Organization Name

meta platforms technologies, llc

Inventor(s)

Jaspreet Singh Gandhi of San Jose CA (US)

Jaesik Lee of San Jose CA (US)

Rajendra D Pendse of Fremont CA (US)

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240332252 titled 'HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

The abstract of this patent application describes a multi-chiplet assembly that includes logic chiplets, memory chiplets, and bridging chiplets to facilitate electrical coupling between the various components.

• The multi-chiplet assembly comprises a first logic chiplet, a memory chiplet connected to the first logic chiplet, a second logic chiplet, and a bridging chiplet linking the first and second logic chiplets.
• The assembly enables efficient communication and data transfer between the different chiplets, enhancing overall performance and functionality.
• By utilizing multiple chiplets, the assembly can achieve higher levels of integration and customization for specific applications.
• The bridging chiplet plays a crucial role in facilitating seamless connectivity and coordination between the logic chiplets in the assembly.
• This innovative approach to chiplet assembly design offers flexibility, scalability, and improved system efficiency.

Potential Applications: - High-performance computing systems - Data centers - Artificial intelligence and machine learning applications - Internet of Things (IoT) devices - Embedded systems

Problems Solved: - Enhances communication and data transfer efficiency - Increases integration and customization options - Improves overall system performance and functionality

Benefits: - Enhanced system performance - Greater flexibility and scalability - Customizable design options - Improved efficiency and data processing capabilities

Commercial Applications: Title: "Advanced Chiplet Assembly for Enhanced System Performance" This technology can be applied in various commercial sectors, including: - Semiconductor industry - Computer hardware manufacturers - Telecommunications companies - Consumer electronics manufacturers

Questions about Multi-Chiplet Assembly: 1. How does the bridging chiplet facilitate communication between the logic chiplets? 2. What are the advantages of using multiple chiplets in a single assembly?

Frequently Updated Research: Stay updated on the latest advancements in chiplet technology and assembly techniques to ensure optimal performance and compatibility with emerging technologies.

Original Abstract Submitted

a multi-chiplet assembly may include a first logic chiplet. a multi-chiplet assembly may include a memory chiplet electrically coupled to the first logic chiplet. a multi-chiplet assembly may include a second logic chiplet. a multi-chiplet assembly may include a bridging chiplet electrically coupling the first logic chiplet to the second logic chiplet. various other apparatuses, systems, and methods are also disclosed.