18361168. Semiconductor Device Package with Die Stackup and Interposer simplified abstract (Western Digital Technologies, Inc.)

Semiconductor Device Package with Die Stackup and Interposer

Organization Name

Western Digital Technologies, Inc.

Inventor(s)

Nagesh Vodrahalli of Los Altos CA (US)

Chih-Yang Li of Menlo Park CA (US)

Shrikar Bhagath of San Jose CA (US)

Narayanan Terizhandur V of Bothell WA (US)

Semiconductor Device Package with Die Stackup and Interposer - A simplified explanation of the abstract

This abstract first appeared for US patent application 18361168 titled 'Semiconductor Device Package with Die Stackup and Interposer

The semiconductor device package described in the abstract consists of a substrate, a stack of memory dies on the substrate, and an interposer positioned above the substrate and spaced from the memory dies. Two sets of bond pads are connected to the substrate, with the second set located on the interposer. Bond wires connect different sub-stacks of memory dies to their respective bond pads, allowing for electrical connections within the package.

• The semiconductor device package includes a substrate, memory dies, and an interposer.
• Two sets of bond pads are connected to the substrate, with the second set on the interposer.
• Bond wires connect different sub-stacks of memory dies to their respective bond pads.
• The memory dies may be electrically isolated to reduce noise in signal transmission.
• This design allows for efficient electrical connections within the package.

Potential Applications: - Memory modules - Data storage devices - Consumer electronics

Problems Solved: - Noise reduction in signal transmission - Efficient electrical connections within the package

Benefits: - Improved signal integrity - Enhanced performance of memory devices - Compact and reliable semiconductor packaging

Commercial Applications: Title: Advanced Semiconductor Device Package for Memory Modules This technology can be utilized in the production of memory modules for various electronic devices, enhancing their performance and reliability. The market implications include increased demand for high-quality memory solutions in consumer electronics and data storage industries.

Prior Art: Researchers can explore existing patents related to semiconductor packaging, memory modules, and signal transmission in electronic devices to understand the prior art in this field.

Frequently Updated Research: Researchers and industry experts may conduct ongoing studies on semiconductor packaging techniques, memory module design, and signal integrity in electronic devices to further improve the efficiency and performance of such technologies.

Questions about the Technology: 1. How does the design of the semiconductor device package contribute to noise reduction in signal transmission? 2. What are the potential challenges in implementing this advanced packaging technology in memory modules?

Original Abstract Submitted

A semiconductor device package includes a substrate, a stack of memory dies positioned on the substrate, and an interposer spaced from the stack of memory dies and also positioned on the substrate. First and second sets of bond pads are electrically connected to the substrate, where the second set of bond pads is positioned on the interposer above the substrate. A first set of bond wires electrically connects a first sub-stack of the memory dies to the first set of bond pads. A second set of bond wires electrically connects a second sub-stack of memory dies, positioned above the first sub-stack, to the second set of bond wires. The first and second sub-stacks of memory dies may be electrically isolated from one another to reduce noise in electrical signals transmitted to and from the memory dies.