18364685. Integrated Die Ejector for Die Attach Ejector Devices simplified abstract (Western Digital Technologies, Inc.)
Contents
Integrated Die Ejector for Die Attach Ejector Devices
Organization Name
Western Digital Technologies, Inc.
Inventor(s)
Zhonghua Qian of Shanghai (CN)
Integrated Die Ejector for Die Attach Ejector Devices - A simplified explanation of the abstract
This abstract first appeared for US patent application 18364685 titled 'Integrated Die Ejector for Die Attach Ejector Devices
The integrated die ejector is a device used to separate a die from a wafer efficiently.
- The ejector mechanism includes an ejector pin for the separation process.
- An ejector base is connected to the ejector pin and links the die ejector to a die attach ejector machine.
- A pepper pot surrounds the ejector mechanism and base, with a sleeve positioned between the pepper pot and ejector mechanism.
- The sleeve and pepper pot set motion limits for the ejector base and keep the ejector mechanism in place during operation.
- The integrated die ejector can be easily attached and detached from the die attach ejector machine as a single unit, reducing installation time.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Industrial automation
Problems Solved: - Streamlining the die separation process - Enhancing efficiency in manufacturing processes
Benefits: - Faster installation and operation - Improved precision in die separation - Reduced downtime in production lines
Commercial Applications: Title: Advanced Die Ejector System for Semiconductor Manufacturing This technology can be utilized in semiconductor fabrication facilities to enhance production efficiency and reduce operational costs.
Questions about the integrated die ejector: 1. How does the integrated die ejector improve the die separation process compared to traditional methods? 2. What are the key components of the integrated die ejector system and how do they work together?
Frequently Updated Research: Researchers are constantly exploring ways to optimize the design and functionality of die ejector systems to further improve manufacturing processes.
Original Abstract Submitted
An integrated die ejector for separating a die from a wafer, the die ejector includes an ejector mechanism that includes an ejector pin. There is an ejector base coupled to the ejector pin and configured to couple the integrated die ejector to a die attach ejector machine. There is a pepper pot at least partially surrounding the ejector mechanism and ejector base and a sleeve coupled thereto and positioned between the ejector mechanism and pepper pot. The sleeve and pepper pot define an upper and lower motion limit of the ejector base and retain the ejector mechanism within the pepper pot such that the integrated die ejector may be coupled to and decoupled from the die attach ejector machine as a single unit to reduce installation time.
