18589470. Stripline Wafer for Wafer Based Connector System simplified abstract (TE Connectivity Solutions GmbH)

Stripline Wafer for Wafer Based Connector System

Organization Name

TE Connectivity Solutions GmbH

Inventor(s)

Bruce Allen Champion of Camp Hill PA (US)

Charles Raymond Gingrich, Iii of Mechanicsburg PA (US)

Keith Edwin Miller of Manheim PA (US)

Michael Frank Cina of Elizabethtown PA (US)

Scott Eric Walton of Mount Joy PA (US)

Joshua Allen Rosenau of York PA (US)

Stripline Wafer for Wafer Based Connector System - A simplified explanation of the abstract

This abstract first appeared for US patent application 18589470 titled 'Stripline Wafer for Wafer Based Connector System

• • Simplified Explanation:**

The patent application describes a multilayer stripline wafer for electrical connectors, with signal transmission pathways and conductive planar members to control impedance.

• • Key Features and Innovation:**
• Multilayer design with signal transmission pathways on internal layers
• Uncoupled or loosely coupled single-ended or differentially coupled signal transmission pathways
• Conductive planar members spaced from signal transmission pathways to control impedance

• • Potential Applications:**

This technology can be used in various electrical connectors, high-speed data transmission systems, and telecommunications equipment.

• • Problems Solved:**

The technology addresses the need for improved signal transmission quality, impedance control, and reduced signal interference in electrical connectors.

• • Benefits:**
• Enhanced signal transmission quality
• Improved impedance control
• Reduced signal interference

• • Commercial Applications:**

This technology has potential commercial applications in the telecommunications industry, data centers, and high-speed electronic devices.

• • Questions about Multilayer Stripline Wafer:**

1. How does the multilayer design of the stripline wafer improve signal transmission quality? 2. What are the specific benefits of using conductive planar members to control impedance in signal transmission pathways?

Original Abstract Submitted

A multilayer stripline wafer for use in an electrical connector. The multilayer stripline wafer includes multiple layers. Signal transmission pathways are positioned on at least one internal layer of the multiple layers. The signal transmission pathways may be uncoupled or loosely coupled singe ended single ended signal transmission pathways or differentially coupled signal transmission pathways. Conductive planar members are positioned in one or more layers of the multiple layers. The conductive planar members are spaced from the signal transmission pathways. One or more conductive planar members controls the impedance of the signal transmission pathways.