18604807. Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height simplified abstract (TE Connectivity Solutions GmbH)

Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height

Organization Name

TE Connectivity Solutions GmbH

Inventor(s)

Kaspar Jenni of Muhlenstrasse (CH)

Ismael Brunner of Schaffhausen (CH)

Thomas Arnold of Schaffhausen (CH)

Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height - A simplified explanation of the abstract

This abstract first appeared for US patent application 18604807 titled 'Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height

The semiconductor die described in the patent application has a top side, a bottom side, and a side surface connecting the two sides. The bottom side and part of the side surface can be attached to a solid structure using a die attach material.

• The side surface of the semiconductor die includes an attachment control element that defines an attachment zone contacted by the die attach material.
• The side surface may also have an exclusion zone that is not contacted by the die attach material.

Potential Applications: - This technology could be used in the manufacturing of electronic devices where precise attachment of semiconductor dies is crucial. - It may find applications in the automotive industry for sensors and control units where reliable attachment is necessary.

Problems Solved: - Provides a method for securely attaching semiconductor dies to solid structures. - Ensures precise control over the attachment process to avoid damage to the semiconductor die.

Benefits: - Improved reliability in electronic devices due to secure attachment of semiconductor dies. - Enhanced manufacturing efficiency by streamlining the attachment process.

Commercial Applications: Title: Advanced Semiconductor Die Attachment Technology This technology could be utilized in the production of various electronic devices, such as smartphones, tablets, and automotive components. The market implications include improved product quality and reliability, leading to increased consumer trust and satisfaction.

Prior Art: Readers interested in exploring prior art related to semiconductor die attachment technologies can start by researching existing patents in the field of semiconductor packaging and assembly methods.

Frequently Updated Research: Stay informed about the latest advancements in semiconductor die attachment technologies by following industry publications, attending conferences, and monitoring research studies in the field.

Questions about Semiconductor Die Attachment Technology: 1. What are the key advantages of using an attachment control element in semiconductor die attachment? 2. How does the exclusion zone in the side surface of the semiconductor die contribute to the overall attachment process?

Original Abstract Submitted

A semiconductor die includes a top side, a bottom side opposite to the top side, and a side surface connecting the top side and the bottom side. The bottom side and a part of the side surface are attachable to a solid structure by a die attach material. The side surface has an attachment control element defining an attachment zone contacted by the die attach material and/or an exclusion zone that is not contacted by the die attach material.