18601076. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CHECKING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)

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SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CHECKING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

Organization Name

Kokusai Electric Corporation

Inventor(s)

Takuya Saito of Toyama (JP)

Taiyo Okazaki of Toyama (JP)

Shin Hiyama of Toyama (JP)

Shin Tsujimura of Toyama (JP)

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CHECKING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18601076 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CHECKING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

Simplified Explanation: The patent application describes a technique for determining abnormalities in substrates transferred to a load lock chamber with less reliance on the chamber's structure. The substrate processing apparatus includes a substrate support, an elevator, sensors, and a controller with an abnormality determinator.

  • Substrate processing apparatus with abnormality determination capability
  • Substrate support for multiple substrates at predetermined intervals
  • Elevator for raising and lowering the substrate support
  • Sensors to check substrate state in the load lock chamber
  • Controller with abnormality determinator based on sensor data and threshold value

Key Features and Innovation:

  • Multistage substrate support for efficient processing
  • Sensors for real-time monitoring of substrate condition
  • Abnormality determinator for quick detection of issues
  • Controller for automated control of abnormality determinations
  • Less dependence on load lock chamber structure for abnormality detection

Potential Applications:

  • Semiconductor manufacturing
  • Thin film deposition processes
  • Solar panel production
  • LED manufacturing
  • Microelectronics fabrication

Problems Solved:

  • Efficient abnormality detection in substrate processing
  • Real-time monitoring of substrate condition
  • Automation of abnormality determinations
  • Reduced reliance on load lock chamber structure
  • Improved quality control in manufacturing processes

Benefits:

  • Enhanced process efficiency
  • Improved product quality
  • Reduced downtime due to abnormality detection
  • Automated monitoring and control
  • Cost savings in manufacturing operations

Commercial Applications: Potential commercial applications of this technology include semiconductor manufacturing, thin film deposition processes, solar panel production, LED manufacturing, and microelectronics fabrication. The innovation offers improved process efficiency, product quality, and cost savings in manufacturing operations.

Questions about Substrate Processing Apparatus: 1. How does the abnormality determinator function in the substrate processing apparatus? 2. What are the key benefits of using sensors for real-time monitoring in substrate processing?


Original Abstract Submitted

A technique capable of performing an abnormality determination on each substrate transferred to a load lock chamber with less dependence a structure of the load lock chamber is described. A substrate processing apparatus includes: a substrate support provided in the load lock chamber and capable of supporting a plurality of substrates in a multistage manner at predetermined intervals; an elevator capable of elevating and lowering the substrate support; a plurality of sensors respectively provided on outer peripheral portions of the upper region and the lower region in the load lock chamber and configured to check a state of the substrate supported by the substrate support; and a controller including an abnormality determinator and configured to be capable of controlling the abnormality determinator configured to perform an abnormality determination on the substrate based on data respectively sent from the plurality of sensors and a predetermined threshold value.