18597316. Material For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
Contents
Material For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film
Organization Name
Inventor(s)
Mamoru Watabe of Joetsu-shi (JP)
Shohel Iwamori of Joetsu-shi (JP)
Yusuke Biyajima of Joetsu-shi (JP)
Material For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film - A simplified explanation of the abstract
This abstract first appeared for US patent application 18597316 titled 'Material For Forming Adhesive Film, Patterning Process, And Method For Forming Adhesive Film
The present invention is a material for forming an adhesive film directly under a resist upper layer film, consisting of a resin with an acid-dissociable group, an organic solvent, and a photo-acid generator.
- The material allows for the formation of an adhesive film in a fine patterning process by a multilayer resist method.
- It provides high adhesiveness to a resist upper layer film, prevents fine pattern collapse, and creates excellent pattern profiles.
- The material can be used in a patterning process and a method for forming the adhesive film.
Potential Applications: This technology can be used in the semiconductor industry for photolithography processes, specifically in the fabrication of integrated circuits.
Problems Solved: The material addresses the challenges of creating fine patterns with high adhesion and preventing collapse during the patterning process.
Benefits: The material improves the quality and precision of pattern formation in semiconductor manufacturing, leading to enhanced performance of electronic devices.
Commercial Applications: This technology has significant commercial potential in the semiconductor manufacturing sector, where precise patterning is crucial for device performance and functionality.
Questions about the material: 1. How does this material improve the adhesiveness of the adhesive film to the resist upper layer film? 2. What are the key advantages of using a photo-acid generator in this material?
Frequently Updated Research: Researchers are continually exploring new formulations and applications of materials for fine patterning processes in semiconductor manufacturing. Stay updated on the latest advancements in this field for potential improvements in performance and efficiency.
Original Abstract Submitted
The present invention is a material for forming an adhesive film for an adhesive film formed directly under a resist upper layer film, includes: (A) a resin having a structural unit containing an acid-dissociable group and having two or more units represented by the formula (1) where Rrepresents a hydrogen atom or a methyl group, and Rrepresents a group selected from the formulae (I-1) to (I-3); and (C) an organic solvent, and the material comprises (B) a photo-acid generator and/or the resin (A) having the photo-acid generating unit. This provides a material for forming an adhesive film in a fine patterning process by a multilayer resist method, where the material gives an adhesive film with high adhesiveness to a resist upper layer film, suppresses fine pattern collapse, and can form an excellent pattern profile; a patterning process using the material; and a method for forming the adhesive film.
