18736771. INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME simplified abstract (CORNING INCORPORATED)

INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME

Organization Name

CORNING INCORPORATED

Inventor(s)

Lars Martin Otfried Brusberg of Corning NY (US)

Jin Su Kim of Seoul (KR)

Aramais Robert Zakharian of Painted Post NY (US)

INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18736771 titled 'INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME

Simplified Explanation

The patent application describes integrated circuit packages that combine electrical and optical connectivity, with methods for their production. These packages include a glass substrate, an optical channel, redistribution layers, and an integrated circuit chip. The chip is placed on the glass substrate, enabling optical communication through the optical channel and electrical continuity via the redistribution layers.

• Glass substrate
• Optical channel
• Redistribution layers
• Integrated circuit chip
• Optical and electrical connectivity

Key Features and Innovation

• Integration of optical and electrical connectivity in integrated circuit packages
• Use of glass substrate for optical communication
• Redistribution layers for electrical continuity
• Enhanced functionality and versatility in electronic devices

Potential Applications

The technology can be applied in:

• Data centers
• Telecommunications
• Consumer electronics
• Medical devices
• Automotive industry

Problems Solved

• Simplifies the design of electronic devices
• Enables faster data transfer
• Enhances overall performance and functionality

Benefits

• Improved connectivity options
• Enhanced data transmission speeds
• Increased versatility in device design
• Potential for smaller and more efficient electronic devices

Commercial Applications

• The technology can be utilized in various industries such as telecommunications, consumer electronics, and automotive for improved connectivity and performance.

Prior Art

Readers can explore prior art related to integrated circuit packages, glass substrates, and optical communication technologies in the field of electronic packaging.

Frequently Updated Research

Stay updated on the latest advancements in integrated circuit packaging, glass substrate technologies, and optical communication for electronic devices.

Questions about Integrated Circuit Packages with Optical Connectivity

What are the potential applications of integrated circuit packages with optical connectivity?

Integrated circuit packages with optical connectivity have a wide range of applications in industries such as data centers, telecommunications, consumer electronics, medical devices, and automotive.

How does the integration of optical and electrical connectivity benefit electronic devices?

The integration of optical and electrical connectivity enhances data transmission speeds, simplifies device design, and improves overall performance and functionality.

Original Abstract Submitted

Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.