18124223. POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE simplified abstract (Infineon Technologies AG)
Contents
POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE
Organization Name
Inventor(s)
Christoph Koch of Salzkotten (DE)
Tomas Manuel Reiter of München (DE)
Christian Schweikert of München (DE)
POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18124223 titled 'POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE
The abstract describes a power semiconductor module that consists of an electrically insulative frame housing half bridge circuits, each containing high-side and low-side power semiconductor dies. Structured metal frames are embedded in the insulative frame and connected to the terminals of the semiconductor dies. Openings in the frame expose parts of the metal frames at the sidewalls.
- Electrically insulative frame housing half bridge circuits
- Structured metal frames embedded in the insulative frame
- Metal frames connected to terminals of semiconductor dies
- Openings in the frame exposing metal frame parts
- High-side and low-side power semiconductor dies in each half bridge circuit
Potential Applications: - Power electronics - Motor control systems - Renewable energy systems
Problems Solved: - Enhanced power semiconductor module design - Improved thermal management - Increased efficiency in power conversion
Benefits: - Higher reliability - Better performance - Simplified assembly process
Commercial Applications: Title: Advanced Power Semiconductor Module for Efficient Power Conversion This technology can be utilized in industries such as electric vehicles, renewable energy, industrial automation, and consumer electronics. The market implications include improved energy efficiency, reduced maintenance costs, and enhanced product reliability.
Prior Art: Readers can explore prior art related to power semiconductor modules, structured metal frames in electronic devices, and thermal management in power electronics.
Frequently Updated Research: Stay informed about the latest advancements in power semiconductor technology, structured metal frame design, and thermal management techniques for power modules.
Questions about Power Semiconductor Modules: 1. How does the design of the structured metal frames contribute to the overall performance of the power semiconductor module?
- The structured metal frames provide efficient heat dissipation and electrical connectivity, enhancing the reliability and performance of the module.
2. What are the key factors to consider when selecting power semiconductor dies for half bridge circuits in this module?
- Factors such as voltage rating, current handling capacity, switching speed, and thermal characteristics play a crucial role in choosing the appropriate semiconductor dies for optimal performance.
Original Abstract Submitted
A power semiconductor module includes: an electrically insulative frame; half bridge circuits housed in the electrically insulative frame, each half bridge circuit including one or more high-side power semiconductor dies and one or more low-side power semiconductor dies; a first structured metal frame embedded in the electrically insulative frame and electrically connected to a drain or collector terminal of the one or more high-side power semiconductor dies of each half bridge circuit; a second structured metal frame embedded in the electrically insulative frame and electrically connected to a source or emitter terminal of the one or more low-side power semiconductor dies of each half bridge circuit; and first openings in the electrically insulative frame that expose part of the first structured metal frame or part of the second structured metal frame at opposing first and second sidewalls of the electrically insulative frame and between adjacent ones of the half bridge circuits.
