18674681. ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME simplified abstract (LG Display Co., Ltd.)
Contents
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
Organization Name
Inventor(s)
Chang Hyun Song of Goyang-si (KR)
Jae Young Oh of Goyang-si (KR)
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18674681 titled 'ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
The abstract describes an electronic device with pad electrodes, circuit film, solder connections, and insulating adhesive.
- The device has pad electrodes on one side of a substrate and connection electrodes on a circuit film.
- Solder connections are used to connect the connection electrodes to the pad electrodes.
- An insulating adhesive fills the spaces between the pad electrodes and connection electrodes.
- The solder connections have horizontally protruding edges for stability.
- This technology enables efficient and reliable electrical connections in electronic devices.
Potential Applications: This technology can be used in various electronic devices such as smartphones, tablets, and wearable technology. It can also be applied in medical devices, automotive electronics, and industrial equipment.
Problems Solved: This technology solves the problem of establishing secure and durable electrical connections in compact electronic devices. It also addresses the challenge of ensuring consistent performance and reliability in electronic components.
Benefits: Improved electrical connectivity Enhanced device performance and durability Reduced risk of electrical failures Cost-effective manufacturing process
Commercial Applications: This technology can be utilized by electronics manufacturers to enhance the quality and reliability of their products. It can lead to the development of more advanced and compact electronic devices, catering to consumer demand for smaller and more efficient technology.
Prior Art: Researchers and developers can explore prior art related to soldering techniques, electronic interconnects, and adhesive materials used in electronic devices.
Frequently Updated Research: Researchers may be conducting studies on the optimization of soldering processes, the development of new insulating adhesives, and the integration of advanced materials in electronic components.
Questions about Electronic Device with Pad Electrodes: 1. How does this technology improve the reliability of electrical connections in electronic devices? 2. What are the potential challenges in implementing this technology in mass production?
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Original Abstract Submitted
An electronic device can include a plurality of pad electrodes provided at at least one side of a substrate, at least one circuit film configured to have a plurality of connection electrodes provided at an insulating film to correspond to the plurality of pad electrodes, a plurality of solders to conductively connect the plurality of connection electrodes to the plurality of pad electrodes exposed from the circuit film one-to-one, and an insulating adhesive to fill spaces between the plurality of pad electrodes and the plurality of connection electrodes. Also, each of the plurality of solders has an edge horizontally protruding from the insulating film.
