18276516. LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE HAVING SAME simplified abstract (LG INNOTEK CO., LTD.)

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LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE HAVING SAME

Organization Name

LG INNOTEK CO., LTD.

Inventor(s)

Young Jae Choi of Seoul (KR)

Moon Ryong Park of Seoul (KR)

LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE HAVING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18276516 titled 'LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE HAVING SAME

The lighting device described in this patent includes a light emitting device package with lead frames, a body, a cavity, and a light emitting chip.

  • The device is mounted on a circuit board with a resin layer covering it.
  • A reflective member is placed between the resin layer and the circuit board.
  • A light blocking portion overlaps the light emitting device package on the resin layer.
  • The lead frame includes a frame at the bottom of the cavity and a bonding portion for the circuit board.
  • The bonding portion protrudes towards the rear side of the body.

Potential Applications: - This lighting device can be used in various lighting fixtures for residential, commercial, and industrial purposes. - It can also be integrated into automotive lighting systems for vehicles.

Problems Solved: - This device provides efficient and reliable lighting with improved heat dissipation. - The design ensures proper light distribution and minimizes glare.

Benefits: - Enhanced durability and longevity of the lighting device. - Energy-efficient operation with high brightness output. - Improved thermal management for better performance.

Commercial Applications: Title: Advanced LED Lighting Device for Various Applications This technology can be utilized in indoor and outdoor lighting systems, automotive lighting, and specialty lighting applications. The market implications include increased energy savings, improved lighting quality, and reduced maintenance costs for users.

Prior Art: For prior art related to this technology, researchers can explore patents and publications in the field of LED lighting devices, thermal management in lighting systems, and advancements in light emitting chip technology.

Frequently Updated Research: Researchers can stay updated on the latest developments in LED lighting technology, thermal management solutions, and advancements in light emitting chip design to enhance the performance and efficiency of lighting devices.

Questions about LED Lighting Devices: 1. How does the design of this lighting device improve heat dissipation compared to traditional lighting fixtures? - The design of this lighting device includes a reflective member and a resin layer that help dissipate heat efficiently, ensuring optimal performance and longevity.

2. What are the potential cost savings for users when using this advanced LED lighting device? - Users can benefit from reduced energy consumption, lower maintenance costs, and longer lifespan of the lighting device, resulting in overall cost savings in the long run.


Original Abstract Submitted

The lighting device disclosed in the embodiment of the invention includes a light emitting device package including a plurality of lead frames, a body coupled to the plurality of lead frames, a cavity in which a front side portion of the body is opened, and a light emitting chip disposed on a first lead frame that is any one of the plurality of lead frames; a circuit board on which the light emitting device package is disposed and having a first pad portion; a resin layer covering the light emitting device package on the circuit board; a reflective member disposed between the resin layer and the circuit board and into which a lower portion of the light emitting device package is inserted; and a light blocking portion overlapping the light emitting device package in a vertical direction on the resin layer, wherein the first lead frame may include a first frame disposed at a bottom of the cavity and is bent from the first frame to a lower surface of the body, and a first bonding portion coupled to the first pad portion of the circuit board, and the first bonding portion may protrude from the lower surface of the body toward a rear side portion of the body more than the rear side portion of the body.