18439249. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Renesas Electronics Corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18439249 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application consists of multiple wires, with each wire connected to specific electrodes and terminals. The first wire is connected to end portion electrodes and a first terminal, while the second wire is connected to non-end portion electrodes and a second terminal. The first wire has a greater loop height compared to the second wire.
Key Features and Innovation:
- Plurality of wires in a semiconductor device
- Specific connections of wires to electrodes and terminals
- Variation in loop height between wires
Potential Applications: This technology could be applied in various semiconductor devices, such as integrated circuits, sensors, and memory devices.
Problems Solved: This technology addresses the need for efficient and precise wiring connections in semiconductor devices.
Benefits: The benefits of this technology include improved performance, reliability, and functionality of semiconductor devices.
Commercial Applications: Title: Enhanced Wiring Technology for Semiconductor Devices This technology could be commercially used in the semiconductor industry for manufacturing advanced electronic components with optimized wiring configurations.
Prior Art: Readers can explore prior art related to semiconductor wiring technologies, semiconductor device manufacturing processes, and wire bonding techniques.
Frequently Updated Research: Researchers are continuously exploring new methods to enhance the efficiency and performance of semiconductor devices through innovative wiring technologies.
Questions about Semiconductor Wiring Technology: 1. What are the key advantages of using wires with varying loop heights in semiconductor devices? 2. How does the specific connection of wires to electrodes and terminals impact the overall performance of the semiconductor device?
Original Abstract Submitted
A plurality of wires of a semiconductor device includes: a first wire connected to each of an end portion electrode and a first terminal of a plurality of terminals; and a second wire connected to each of a non-end portion electrode and a second terminal of the plurality of terminals. A loop height of the first wire is greater than a loop height of the second wire.
