18577077. CIRCUIT BOARD simplified abstract (LG INNOTEK CO., LTD.)
Contents
CIRCUIT BOARD
Organization Name
Inventor(s)
Byeong Kyun Choi of Seoul (KR)
CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18577077 titled 'CIRCUIT BOARD
The abstract describes a circuit board with a unique via structure that connects two circuit pattern layers.
- Insulating layer
- First circuit pattern layer on top of the insulating layer
- Second circuit pattern layer below the insulating layer
- Via passing through the insulating layer to connect the two circuit pattern layers
- Via has a varying width, with a minimum width at a specific region
- Second width of the via is 70% to 99% of the first width
Potential Applications: - Electronics manufacturing - Printed circuit board design - Semiconductor industry
Problems Solved: - Efficiently connecting circuit pattern layers - Ensuring signal integrity in electronic devices
Benefits: - Improved signal transmission - Enhanced reliability of circuit connections - Space-saving design
Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Signal Transmission This technology can be used in various electronic devices such as smartphones, computers, and automotive systems to improve signal transmission efficiency and reliability.
Prior Art: Researchers can explore prior patents related to via structures in circuit boards to understand the evolution of this technology.
Frequently Updated Research: Researchers in the field of electronics manufacturing may be conducting studies on optimizing via structures for improved circuit performance.
Questions about Circuit Board Via Technology: 1. How does the unique via structure in this circuit board improve signal transmission compared to traditional designs? 2. What are the potential challenges in implementing this advanced via structure in mass production of circuit boards?
Original Abstract Submitted
A circuit board according to an embodiment includes an insulating layer, a first circuit pattern layer disposed on the insulating layer; a second circuit pattern layer disposed below the insulating layer; and a via passing through the insulating layer and connecting the first circuit pattern layer and the second circuit pattern layer, wherein the via has a first width at an upper surface and a second width less than the first width at a first region between the upper surface and a lower surface, wherein the first region is a region with a minimum width among all regions of the via, and wherein the second width satisfies a range of 70% to 99% of the first width.
