18612075. PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)

From WikiPatents
Revision as of 05:30, 1 October 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

PLASMA PROCESSING APPARATUS

Organization Name

Tokyo Electron Limited

Inventor(s)

Masaki Hirayama of Tokyo (JP)

PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18612075 titled 'PLASMA PROCESSING APPARATUS

  • Simplified Explanation:

The patent application describes a plasma processing apparatus with a temperature regulator that includes multiple fans and a flow path. The flow path is symmetrical with respect to a central axis and consists of two partial flow paths.

  • Key Features and Innovation:

- Temperature regulator with multiple fans - Axially or rotationally symmetrical flow path - First partial flow path along the upper surface of an excitation electrode - Second partial flow path extending alternately in opposite directions between the fans and the first partial flow path

  • Potential Applications:

- Plasma processing in semiconductor manufacturing - Surface treatment of materials - Thin film deposition processes

  • Problems Solved:

- Maintaining consistent temperature in plasma processing - Enhancing efficiency of plasma treatment processes - Improving uniformity of plasma distribution

  • Benefits:

- Precise temperature control - Increased process efficiency - Enhanced product quality

  • Commercial Applications:

Title: "Advanced Plasma Processing Apparatus for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities to improve the quality and efficiency of plasma processing, leading to better semiconductor products and increased production yields.

  • Questions about Plasma Processing Apparatus:

1. How does the temperature regulator with multiple fans contribute to the efficiency of plasma processing? 2. What are the specific advantages of having a symmetrical flow path in the plasma processing apparatus?


Original Abstract Submitted

A plasma processing apparatus includes a temperature regulator, which includes a plurality of fans and provides a flow path, wherein the flow path is axially or rotationally symmetrical with respect to a central axis and includes a first partial flow path and a second partial flow path, and wherein the first partial flow path extends along an upper surface of an excitation electrode, and the second partial flow path extends alternately in opposite directions between the plurality of fans and the first partial flow path.