18671953. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
Contents
ELECTRONIC DEVICE
Organization Name
Inventor(s)
Chin-Lung Ting of Miao-Li County (TW)
Chung-Kuang Wei of Miao-Li County (TW)
Li-Wei Mao of Miao-Li County (TW)
Chi-Liang Chang of Miao-Li County (TW)
Chia-Hui Lin of Miao-Li County (TW)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18671953 titled 'ELECTRONIC DEVICE
The present disclosure describes an electronic device with a substrate, bumps, diodes, and a shielding layer. The substrate has first through holes, bumps are on the substrate, diodes are also on the substrate, and a shielding layer covers the substrate. One bump is positioned between two adjacent diodes in a cross-sectional view, and the shielding layer overlaps some of the bumps and first through holes.
- The electronic device includes a substrate with first through holes.
- Bumps are placed on the substrate.
- Diodes are mounted on the substrate.
- A shielding layer is applied over the substrate.
- Bumps are strategically located between diodes in a cross-sectional view.
- The shielding layer covers parts of the bumps and first through holes.
Potential Applications: - This technology can be used in electronic devices such as smartphones, tablets, and laptops. - It can also be applied in power supply units, LED lighting systems, and solar panels.
Problems Solved: - Provides protection for diodes and other components on the substrate. - Ensures efficient functioning of the electronic device by shielding against external interference.
Benefits: - Enhanced durability and reliability of electronic devices. - Improved performance and longevity of diodes. - Increased resistance to external factors such as electromagnetic interference.
Commercial Applications: Title: "Enhanced Electronic Device with Diode Protection" This technology can be utilized in the consumer electronics industry for manufacturing smartphones, tablets, and laptops with improved durability and performance. It can also be integrated into power supply units and LED lighting systems for enhanced reliability and longevity.
Questions about the technology: 1. How does the shielding layer protect the diodes and other components on the substrate? 2. What are the potential commercial applications of this electronic device technology?
Original Abstract Submitted
The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.
