18603515. ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)
Contents
ELECTRONIC COMPONENT STRUCTURE
Organization Name
Inventor(s)
Toshihiro Iguchi of Tokyo (JP)
Tomohisa Fukuoka of Tokyo (JP)
ELECTRONIC COMPONENT STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603515 titled 'ELECTRONIC COMPONENT STRUCTURE
The abstract of the patent application describes an electronic component structure that includes a first electronic component, a second electronic component, a low melting point layer containing a first metal material with a melting point of 300°C or lower, and a high melting point layer containing a second metal material with a melting point of 400°C or higher. The first and second electronic components are connected by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.
- The electronic component structure includes a low melting point layer with a first metal material and a high melting point layer with a second metal material.
- The first and second electronic components are connected by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.
- The first metal material in the low melting point layer has a melting point of 300°C or lower.
- The second metal material in the high melting point layer has a melting point of 400°C or higher.
Potential Applications: - This technology could be used in electronic devices to improve connectivity and reliability. - It may find applications in the automotive industry for enhanced electronic component structures.
Problems Solved: - Provides a reliable and efficient way to connect electronic components. - Helps in reducing the risk of damage due to overheating.
Benefits: - Improved connectivity between electronic components. - Enhanced durability and reliability of electronic devices.
Commercial Applications: - This technology could be valuable in the manufacturing of consumer electronics, automotive electronics, and industrial equipment.
Questions about the technology: 1. How does the multilayer connection portion improve the performance of electronic components? 2. What are the potential challenges in implementing this technology in different industries?
Original Abstract Submitted
An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.
