18671652. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Kenji Hayashi of Kyoto-shi (JP)
Kohei Tanikawa of Kyoto-shi (JP)
Ryosuke Fukuda of Kyoto-shi (JP)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18671652 titled 'SEMICONDUCTOR MODULE
The semiconductor module described in the patent application consists of a first conductive portion, a second conductive portion, first semiconductor elements, second semiconductor elements, input terminals, output terminal, conducting members, and input terminal.
- The semiconductor module includes two sets of semiconductor elements bonded to separate conductive portions.
- The input terminals are of opposite polarity and connected to the respective conductive portions.
- The output terminal is connected to one of the conductive portions.
- Conducting members connect the semiconductor elements to the corresponding conductive portions and input terminals.
Potential Applications: - Power electronics - Renewable energy systems - Electric vehicles - Industrial automation - Consumer electronics
Problems Solved: - Efficient power distribution - Improved electrical connectivity - Enhanced performance of semiconductor devices
Benefits: - Increased reliability - Higher efficiency - Compact design - Enhanced safety features
Commercial Applications: The semiconductor module can be used in various industries such as automotive, renewable energy, telecommunications, and industrial automation. It can be integrated into power converters, inverters, motor drives, and other electronic systems to improve performance and reliability.
Questions about the technology: 1. How does the semiconductor module improve power distribution efficiency? 2. What are the key advantages of using separate conductive portions for different sets of semiconductor elements?
Original Abstract Submitted
A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.
