18185900. FACEPLATE LOADING PLATFORM simplified abstract (Applied Materials, Inc.)
Contents
FACEPLATE LOADING PLATFORM
Organization Name
Inventor(s)
Thyagarajan Kathavarayan of Bangalore (IN)
FACEPLATE LOADING PLATFORM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18185900 titled 'FACEPLATE LOADING PLATFORM
The patent application describes semiconductor component assembly platforms with a base frame, telescoping frame, and component support that can be compressed or fully extended.
- The base frame has a frame body extending from a first end to a second end.
- A telescoping frame is movably connected to the base frame.
- A component support is movably connected to the telescoping frame.
- The platforms can be in a compressed position or a fully extended position.
- In the compressed position, the telescoping frame is above the base frame.
- In the extended position, the telescoping frame is between the ends of the base frame, and the component support is outward of the telescoping frame.
- The fully extended length is at least 1.2 times greater than the compressed length.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Research and development in the semiconductor industry
Problems Solved: - Efficient handling and assembly of semiconductor components - Adjustable platform for different assembly requirements
Benefits: - Increased productivity in semiconductor manufacturing - Versatile platform for various component assembly needs - Space-saving design for compact work areas
Commercial Applications: Title: "Versatile Semiconductor Component Assembly Platforms for Enhanced Productivity" This technology can be used in semiconductor manufacturing facilities, electronics assembly plants, and research labs to streamline component assembly processes and improve overall efficiency.
Questions about Semiconductor Component Assembly Platforms: 1. How do semiconductor component assembly platforms contribute to increased productivity in manufacturing?
- Semiconductor component assembly platforms provide a versatile and adjustable solution for handling and assembling semiconductor components, allowing for efficient workflows and optimized production processes.
2. What are the key features of semiconductor component assembly platforms that make them suitable for various assembly requirements?
- The telescoping frame and component support of semiconductor component assembly platforms allow for easy adjustment and customization to accommodate different sizes and types of semiconductor components.
Original Abstract Submitted
Exemplary semiconductor component assembly platforms include a base frame having a frame body extending from a first end to a second end. The component assembly platforms include a telescoping frame movably connected to the base frame and a component support movably connected to the telescoping frame. Semiconductor component assembly platforms exhibit a compressed position and a fully extended position. In a compressed position, a first end of the telescoping frame is disposed substantially above a first end of the base frame. In an extended position, the first end of the telescoping frame is disposed between the first end and the second end of the base frame, and a second end of the component support is disposed outward of the second end of the telescoping frame. The component assembly platform may be characterized by having a fully extended length that is at least about 1.2 times greater than the compressed length.
