18123090. RADIATION SEPARATION SYSTEM simplified abstract (Applied Materials, Inc.)
Contents
RADIATION SEPARATION SYSTEM
Organization Name
Inventor(s)
Wolfgang R. Aderhold of Cupertino CA (US)
RADIATION SEPARATION SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18123090 titled 'RADIATION SEPARATION SYSTEM
The present disclosure pertains to a lamp-heated apparatus for thermally processing a substrate, specifically focusing on using a substrate and shield part to separate heating zones in a rapid thermal processing (RTP) chamber.
- Placing a substrate into a processing chamber on lift pins
- Pre-heating the substrate with heat from lamps positioned above it
- Processing the substrate on a substrate support after pre-heating
- Removing the substrate from the processing chamber
Potential Applications: - Semiconductor manufacturing - Solar panel production - Thin film deposition processes
Problems Solved: - Efficient thermal processing of substrates - Precise control of heating zones - Minimization of substrate damage
Benefits: - Improved processing efficiency - Enhanced substrate quality - Cost-effective thermal processing solution
Commercial Applications: Title: Advanced Substrate Thermal Processing System This technology can be utilized in industries such as semiconductor manufacturing, solar energy, and electronics production, offering a reliable and efficient method for substrate processing.
Questions about the technology: 1. How does the use of lift pins improve substrate processing efficiency? 2. What are the advantages of separating heating zones in an RTP chamber?
Frequently Updated Research: Ongoing research in the field of rapid thermal processing focuses on optimizing heating methods and enhancing substrate quality through innovative techniques. Stay updated on the latest advancements in substrate thermal processing for cutting-edge applications.
Original Abstract Submitted
The present disclosure generally relate to a lamp-heated apparatus for thermally processing a substrate. In particular, embodiments of the present disclosure relate to using a substrate and shield part to separate heating zones in a rapid thermal processing (RTP) chamber. In one implementation, a method of processing substrates includes placing a substrate into a processing chamber on a plurality of lift pins, lifting the substrate with the plurality of lift pins to a pre-heat position coplanar with a flange of a radiation shield, pre-heating the substrate in the pre-heat position with heat from a plurality of lamps, the plurality of lamps positioned above the substrate, lowering the substrate down to a substrate support with the lift pins after the pre-heating, processing the substrate on the substrate support, and removing the substrate from the processing chamber.
