18675646. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Natsuya Yoshida of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18675646 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a lead, semiconductor element, sealing resin, and insulating substrate. The lead includes a die pad with opposite first obverse and reverse surfaces, where the semiconductor element is fixed to the first obverse surface. The sealing resin covers the die pad and the semiconductor element. The insulating substrate consists of a first metal layer, insulating layer, and second metal layer stacked in that order, with second obverse and reverse surfaces facing the same sides as the first obverse and reverse surfaces. The first reverse surface and second obverse surface are fixed to each other, and the sealing resin has obverse and reverse surfaces facing the same sides as the first obverse and reverse surfaces.
- The semiconductor device features a lead with a die pad and a semiconductor element fixed to it.
- The sealing resin covers both the die pad and the semiconductor element.
- The insulating substrate includes metal layers and an insulating layer, providing structural support and insulation for the device.
- The reverse surface of the sealing resin is exposed, allowing for further connections or encapsulation.
Potential Applications: - This technology can be used in various electronic devices requiring semiconductor components. - It can be applied in automotive electronics, consumer electronics, and industrial equipment.
Problems Solved: - Provides a secure and insulated environment for the semiconductor element. - Ensures proper connection and protection of the components within the device.
Benefits: - Improved reliability and durability of semiconductor devices. - Enhanced performance and longevity of electronic products.
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Electronic Performance This technology can be utilized in the manufacturing of electronic devices such as smartphones, tablets, and automotive control systems. It offers improved reliability and performance, making it attractive for companies looking to enhance their product offerings in the market.
Questions about the technology: 1. How does the insulating substrate contribute to the overall functionality of the semiconductor device? 2. What are the potential market implications of implementing this advanced semiconductor device in various electronic products?
Original Abstract Submitted
A semiconductor device includes a lead, semiconductor element, sealing resin and insulating substrate. The lead includes a die pad having first obverse and reverse surfaces opposite from each other in a thickness direction. The semiconductor element is fixed to the first obverse surface. The sealing resin covers the die pad and the semiconductor element. The insulating substrate includes a first metal layer, insulating layer and second metal layer stacked in this order. The insulating substrate includes second obverse and reverse surfaces respectively facing the same sides as the first obverse and reverse surfaces in the thickness direction. The first reverse surface and the second obverse surface are mutually fixed. The sealing resin includes an obverse surface and reverse surface respectively facing the same sides as the first obverse and reverse surfaces in the thickness direction. The second reverse surface is exposed from the reverse surface of the sealing resin.
