18670165. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoshizo Osumi of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18670165 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a die pad, a first semiconductor element, a second semiconductor element, and an insulating element that electrically connects the first and second semiconductor elements while insulating them from each other. Additionally, a dummy element is bonded to the die pad, and a first bonding layer bonds the dummy element and the insulating element. The dummy element contains an insulating layer between the die pad and the first bonding layer.
- The semiconductor device features a die pad, first and second semiconductor elements, an insulating element, a dummy element, and a first bonding layer.
- The insulating element electrically connects the first and second semiconductor elements while insulating them from each other.
- A dummy element is bonded to the die pad, and a first bonding layer bonds the dummy element and the insulating element.
- The dummy element includes an insulating layer between the die pad and the first bonding layer in a thickness direction.
- This design enhances the electrical insulation and connectivity within the semiconductor device.
Potential Applications: - This technology can be applied in various semiconductor devices requiring precise electrical insulation and connectivity. - It can be utilized in the manufacturing of integrated circuits, sensors, and other electronic components.
Problems Solved: - Provides a solution for maintaining electrical isolation between semiconductor elements on a die pad. - Ensures reliable electrical connections within the semiconductor device.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced electrical insulation and connectivity. - Simplified manufacturing processes for semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Electrical Insulation This technology can be commercialized in the semiconductor industry for the production of high-performance electronic devices, integrated circuits, and sensors. The enhanced electrical insulation and connectivity offered by this innovation can lead to more reliable and efficient semiconductor products.
Questions about the technology: 1. How does the insulating element contribute to the electrical connectivity within the semiconductor device? 2. What are the potential advantages of using a dummy element in semiconductor devices for electrical insulation and bonding?
Original Abstract Submitted
A semiconductor device includes a die pad, a first semiconductor element and a second semiconductor element each mounted on the die pad, and an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other. The semiconductor device further includes a dummy element bonded to the die pad and a first bonding layer bonding the dummy element and the insulating element. The dummy element includes an insulating layer located between the die pad and the first bonding layer in a thickness direction.
