18672815. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Yoshihito Otsubo of Nagaokakyo-shi (JP)
Morio Takeuchi of Nagaokakyo-shi (JP)
MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18672815 titled 'MODULE
The abstract of the patent application describes a module consisting of two substrates, with one overlapping the other and electrically connected. An inductor is mounted on one substrate, while shield electrodes are fixed to the other substrate to intercept magnetic flux.
- Module consists of two substrates, one overlapping the other
- Substrates are electrically connected
- Inductor mounted on one substrate
- Shield electrodes fixed to the other substrate to intercept magnetic flux
- Shield electrodes are grounded
Potential Applications: - Electronics - Telecommunications - Power systems
Problems Solved: - Electromagnetic interference - Signal distortion
Benefits: - Improved signal quality - Reduced interference
Commercial Applications: Title: Advanced Shielded Module for Enhanced Signal Quality This technology can be used in various electronic devices to improve signal quality and reduce interference, making it valuable in telecommunications, power systems, and other industries.
Questions about the technology: 1. How does the placement of shield electrodes help reduce electromagnetic interference?
- The shield electrodes intercept and ground magnetic flux, preventing it from affecting the module's operation.
2. What are the potential implications of using this technology in power systems?
- This technology can improve the efficiency and reliability of power systems by reducing signal distortion and interference.
Original Abstract Submitted
A module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.
