18586360. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)

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SEMICONDUCTOR MEMORY DEVICE

Organization Name

Kioxia Corporation

Inventor(s)

Kiichi Tachi of Yokkaichi Mie (JP)

SEMICONDUCTOR MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18586360 titled 'SEMICONDUCTOR MEMORY DEVICE

The semiconductor memory device described in the patent application consists of conductive layers stacked in a stacking direction and extending in a first direction intersecting the stacking direction. Semiconductor columns extend in the stacking direction and face the conductive layers, with charge storage films provided between them. First and second wirings are arranged on one side in the stacking direction with respect to the conductive layers, electrically connected to the semiconductor columns. Sense amplifier units are connected to the first wirings, and a node is commonly connected to the second wirings. One sense amplifier unit is connected to K1 number of first wirings, while the node is connected to K2 number of second wirings, where K2 is greater than K1.

  • Conductive layers stacked in a specific direction
  • Semiconductor columns facing the conductive layers
  • Charge storage films between the layers and columns
  • First and second wirings connected to semiconductor columns
  • Sense amplifier units connected to first wirings
  • Node connected to second wirings

Potential Applications: - High-speed data storage devices - Memory modules for electronic devices - Advanced computing systems

Problems Solved: - Enhanced data storage capacity - Improved data transfer speeds - Efficient memory management

Benefits: - Increased memory performance - Higher data processing speeds - Enhanced overall system efficiency

Commercial Applications: Title: Advanced Semiconductor Memory Devices for High-Performance Computing This technology can be utilized in: - Consumer electronics - Data centers - Artificial intelligence systems

Questions about Semiconductor Memory Devices: 1. How does this technology improve data storage efficiency? This technology enhances data storage efficiency by increasing memory performance and data processing speeds.

2. What are the potential applications of this semiconductor memory device? The potential applications include high-speed data storage devices, memory modules for electronic devices, and advanced computing systems.


Original Abstract Submitted

A semiconductor memory device includes conductive layers stacked in a stacking direction and extending in a first direction intersecting the stacking direction, semiconductor columns extending in the stacking direction and facing the conductive layers, charge storage films provided between the conductive layers and the semiconductor columns, first and second wirings provided on one side in the stacking direction with respect to the conductive layers, arranged in the first direction, and electrically connected to the semiconductor columns, sense amplifier units electrically connected to the first wirings, and a node electrically and commonly connected to the second wirings. One of the sense amplifier units is electrically connected to K1 number of first wirings (where K1 is an integer of 1 or more). The node is electrically connected to K number of second wirings (where K2 is an integer of 2 or more and is greater than K1).