18464738. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Syotaro Ono of Kanazawa Ishikawa (JP)
Hisao Ichijo of Kanazawa Ishikawa (JP)
Hiroaki Yamashita of Kanazawa Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464738 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a die pad with a semiconductor chip on its upper surface, featuring a rectangular shape with an element region and a termination region. It also has first and second electrodes on the chip, a first connector above the termination region, and a sealing resin around the periphery of the chip and connector.
- The semiconductor chip has a rectangular shape with distinct element and termination regions.
- The first connector covers each side of the rectangular shape and is electrically connected to the first electrode.
- A sealing resin seals the periphery of the semiconductor chip and the first connector.
Potential Applications: - This semiconductor device can be used in various electronic applications requiring reliable and efficient connectivity. - It can be utilized in the manufacturing of integrated circuits, sensors, and other semiconductor-based devices.
Problems Solved: - Provides a secure and effective electrical connection between the semiconductor chip and external components. - Ensures protection and longevity of the semiconductor chip by sealing it with resin.
Benefits: - Improved electrical performance and reliability of semiconductor devices. - Enhanced durability and protection against environmental factors. - Simplified manufacturing processes for semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Connectivity This technology can find applications in the production of consumer electronics, automotive electronics, and industrial automation systems. The improved connectivity and protection offered by this semiconductor device can lead to more robust and efficient electronic products in the market.
Questions about Semiconductor Devices: 1. How does the design of the first connector contribute to the overall functionality of the semiconductor device? 2. What are the advantages of using a sealing resin to protect the semiconductor chip in this device?
Frequently Updated Research: Researchers are constantly exploring new materials and designs to enhance the performance and reliability of semiconductor devices. Stay updated on the latest advancements in semiconductor technology to leverage the benefits of cutting-edge innovations.
Original Abstract Submitted
A semiconductor device according to an embodiment includes: a die pad including an upper surface; a semiconductor chip provided on the upper surface, the semiconductor chip including a rectangular shape, and the semiconductor chip including an element region, and a termination region surrounding the element region; a first electrode provided on the semiconductor chip; a second electrode provided on the semiconductor chip; a first connector provided above the termination region, the first connector including a portion covering each of the four sides of the rectangular shape when viewed from above, and the first connector being electrically connected to the first electrode; and a sealing resin sealing a periphery of the semiconductor chip and the first connector.
