18237271. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)

SEMICONDUCTOR DEVICE

Organization Name

Kabushiki Kaisha Toshiba

Inventor(s)

Takeshi Murasaki of Yokohama Kanagawa (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18237271 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The semiconductor device described in the patent application includes a substrate, a semiconductor chip, and a capacitor. The substrate has a grounding terminal at the same potential as the substrate itself. The semiconductor chip is connected to the grounding terminal via a bonding wire and contains a circuit driven by a clock frequency and an analog circuit. The capacitor is connected to either the circuit or the analog circuit through a connection wire.

• The semiconductor device includes a substrate, a semiconductor chip, and a capacitor.
• The substrate has a grounding terminal at the same potential as itself.
• The semiconductor chip contains a circuit and an analog circuit, connected to the grounding terminal via a bonding wire.
• The capacitor is connected to either the circuit or the analog circuit through a connection wire.

Key Features and Innovation

• Integration of a grounding terminal on the substrate to maintain the same potential.
• Connection of the semiconductor chip to the grounding terminal for stability.
• Inclusion of a capacitor for additional circuit stability and performance enhancement.

Potential Applications

This technology can be applied in various semiconductor devices requiring stable grounding and enhanced circuit performance, such as integrated circuits, microprocessors, and memory chips.

Problems Solved

This technology addresses issues related to circuit instability, noise interference, and performance degradation in semiconductor devices.

Benefits

• Improved circuit stability and performance.
• Enhanced noise immunity.
• Increased reliability of semiconductor devices.

Commercial Applications

• This technology can be utilized in the production of high-performance electronic devices, leading to improved product quality and reliability in the consumer electronics market.

Prior Art

Readers can explore prior art related to semiconductor device design, grounding techniques, and capacitor integration in electronic circuits to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research

Stay updated on the latest advancements in semiconductor device technology, grounding methods, and capacitor applications to further enhance the performance and reliability of electronic devices.

Questions about Semiconductor Device Technology

What are the key components of a semiconductor device?

A semiconductor device typically consists of a substrate, a semiconductor chip, and various components such as capacitors, resistors, and transistors that form the circuitry.

How does the integration of a capacitor improve circuit performance in semiconductor devices?

The capacitor helps stabilize the circuit by filtering out noise and providing additional charge storage capacity, leading to enhanced performance and reliability.

Original Abstract Submitted

According to the present embodiment, a semiconductor device includes a substrate, a semiconductor chip, and a capacitor. The substrate includes at least a grounding terminal and is at the same potential as the grounding terminal. The semiconductor chip is arranged on the substrate and connected to the grounding terminal via a first bonding wire, and includes a circuit driven with a predetermined clock frequency and an analog circuit. The capacitor is arranged on the substrate and connected to at least either the circuit or the analog circuit at one end via a connection wire.