18464704. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kazuki Matsuo of Nonoichi Ishikawa (JP)
Masatoshi Arai of Hakusan Ishikawa (JP)
Rie Fujimoto of Komatsu Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464704 titled 'SEMICONDUCTOR DEVICE
The semiconductor chip described in the abstract includes a metallic film, an insulating film with an opening, a bonding material in the opening, and a connector with a bonding surface and an annular groove.
- Metallic film provided on a semiconductor chip
- Insulating film with an opening on the metallic film
- Bonding material in the opening, bonded to the metallic film
- Connector with a bonding surface bonded to the bonding material
- Annular groove on the bonding surface, along the periphery, with specific inner and outer diameter ratios
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Improved bonding between metallic film and connector - Enhanced reliability and performance of semiconductor chips
Benefits: - Increased durability and stability - Better connectivity and signal transmission - Higher quality semiconductor products
Commercial Applications: Title: Advanced Semiconductor Chip Bonding Technology This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics, improving their performance and reliability in the market.
Prior Art: Researchers can explore patents related to semiconductor chip bonding technology, metallic film applications, and connector design to understand the existing knowledge in this field.
Frequently Updated Research: Researchers in the semiconductor industry are constantly developing new materials and techniques to enhance chip performance and connectivity. Stay updated on the latest advancements in semiconductor bonding technology for potential improvements in this area.
Questions about Semiconductor Chip Bonding Technology: 1. How does the annular groove on the connector's bonding surface contribute to the overall performance of the semiconductor chip? 2. What are the specific materials used in the bonding material for optimal results in semiconductor chip manufacturing?
Original Abstract Submitted
A semiconductor chip according to an embodiment includes a metallic film provided on a semiconductor chip; an insulating film provided on the metallic film and having an opening; a bonding material provided on the metal film in the opening, and the bonding material being bonded to the metallic film; and a connector including a bonding surface bonded to the bonding material, and an annular groove provided on the bonding surface, the annular groove being along the periphery of the bonding surface, and an inner diameter of the annular groove being 60% or more and 90% or less of an outer diameter of the annular groove.
