18596794. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Toru Shono of Himeji Hyogo (JP)
Naoya Nishijima of Ibo Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18596794 titled 'SEMICONDUCTOR DEVICE
The embodiment described in the abstract includes a semiconductor portion, electrodes, control electrodes, a conductive plate, and bonding material. The semiconductor portion is mounted on the conductive plate using the bonding material.
- The semiconductor portion, electrodes, and control electrodes are positioned above the semiconductor portion, while the conductive plate is located below it.
- The conductive plate has a mounting portion where the semiconductor portion is mounted, surrounded by a thin portion that is thinner than the mounting portion.
- In a plan view, both the semiconductor portion and the conductive plate are rectangular, with the vertices of the semiconductor portion located in the thin portion.
Potential Applications: - This technology could be used in semiconductor devices for various electronic applications. - It may find applications in the manufacturing of sensors, actuators, and other microelectromechanical systems (MEMS).
Problems Solved: - Provides a stable and reliable mounting structure for the semiconductor portion. - Ensures proper electrical connections between the semiconductor portion and the electrodes.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced durability and longevity of the overall system.
Commercial Applications: Title: Advanced Semiconductor Mounting Technology for Electronics Industry This technology could be utilized in the production of advanced electronic devices, such as smartphones, tablets, and IoT devices. It could also benefit the automotive industry for sensor and control systems.
Questions about the technology: 1. How does the thin portion surrounding the mounting portion contribute to the overall performance of the semiconductor device? - The thin portion helps to reduce stress and strain on the semiconductor portion during operation, enhancing its reliability. 2. What are the potential cost savings associated with using this innovative mounting technology in semiconductor devices? - The improved reliability and longevity of the devices could lead to reduced maintenance and replacement costs over time.
Original Abstract Submitted
An embodiment includes a semiconductor portion, a first electrode, a second electrode, a first control electrode, a second control electrode, a conductive plate, and a bonding material. The first electrode, the second electrode, the first control electrode, and the second control electrode are provided above the semiconductor portion. The conductive plate is provided below the semiconductor portion. The bonding material is provided between the semiconductor portion and the conductive plate. A thin portion is thinner than a mounting portion. In a plan view, the semiconductor portion and the conductive plate are rectangular, and the conductive plate includes the mounting portion on which the semiconductor portion is mounted and the thin portion surrounding the mounting portion. Vertices of the semiconductor portion are located in the thin portion.
