18458899. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Riku Katamawari of Nonoichi Ishikawa (JP)
Hideharu Kojima of Kanazawa Ishikawa (JP)
Takeyuki Suzuki of Kaga Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18458899 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a lead frame and a semiconductor chip, with the electrode of the semiconductor chip having a protrusion surrounding the frame convex portion.
- The lead frame includes a frame main surface and a frame convex portion.
- The semiconductor chip includes a semiconductor layer and an electrode on the bottom surface of the semiconductor layer.
- The electrode is bonded to the frame convex portion and has a protrusion surrounding it.
- The outer side surface of the protrusion is flush with a side surface of the semiconductor layer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial machinery, and medical devices.
Problems Solved: - Provides a secure and efficient bonding between the semiconductor chip and the lead frame. - Ensures proper electrical connections for the semiconductor device.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced durability and longevity of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Bonding Technology for Enhanced Device Performance This technology can be commercially utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment. It can lead to more reliable and efficient electronic devices, thereby increasing customer satisfaction and market competitiveness.
Questions about Semiconductor Bonding Technology: 1. How does the protrusion surrounding the frame convex portion improve the bonding between the semiconductor chip and the lead frame? - The protrusion provides a larger contact area for bonding, enhancing the stability and reliability of the connection.
2. What are the potential challenges in implementing this semiconductor bonding technology in mass production? - Some challenges may include optimizing the manufacturing process for high volume production and ensuring consistent quality control throughout the manufacturing process.
Original Abstract Submitted
A semiconductor device according to the present embodiment includes a lead frame and a semiconductor chip. The lead frame includes a frame main surface and a frame convex portion provided on the frame main surface. The semiconductor chip includes a semiconductor layer and an electrode provided on a bottom surface of the semiconductor layer and bonded to the frame convex portion. The electrode of the semiconductor chip has a protrusion surrounding the frame convex portion, and an outer side surface of the protrusion is flush with a side surface of the semiconductor layer.
