18735408. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Younglyong Kim of Anyang-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18735408 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes an interposer substrate with three semiconductor chips facing each other, underfill parts between the chips and the substrate, and side-fill parts extending from the side walls of the chips.
- Interposer substrate with three semiconductor chips facing each other
- Underfill parts between the chips and the substrate
- Side-fill parts extending from the side walls of the chips
Potential Applications: - Semiconductor industry for advanced packaging solutions - Electronics manufacturing for improved chip connectivity
Problems Solved: - Enhanced thermal management for semiconductor chips - Improved structural integrity of semiconductor packages
Benefits: - Increased reliability and performance of semiconductor devices - Efficient heat dissipation for high-power applications
Commercial Applications: Title: Advanced Semiconductor Packaging Solutions for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics, to improve overall functionality and reliability.
Questions about Semiconductor Packaging:
1. How does the side-fill part contribute to the structural integrity of the semiconductor package? The side-fill part helps to support the semiconductor chips and prevent damage during operation by providing additional reinforcement to the package.
2. What are the advantages of using an interposer substrate in semiconductor packaging? An interposer substrate allows for more efficient heat dissipation and improved electrical connections between semiconductor chips, leading to enhanced performance and reliability.
Original Abstract Submitted
A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips may be provided.
