18614285. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunggil Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18614285 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first package substrate with a semiconductor device mounted on one surface and connected to the substrate. The package also features connection pads on the opposite surface, external connection terminals on some of these pads, passive elements mounted on other pads without external terminals, and a floating structure positioned between passive elements and external connection terminals.
- The semiconductor package includes a unique floating structure that separates passive elements and external connection terminals.
- Passive elements are mounted on connection pads without external terminals, improving the overall design and functionality of the package.
- External connection terminals are strategically placed on specific connection pads for efficient connectivity.
- The floating structure enhances the performance and reliability of the semiconductor package by providing proper spacing between components.
- This innovation in semiconductor packaging technology aims to optimize the layout and functionality of electronic devices.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, industrial equipment, and communication devices.
Problems Solved: - Efficient spacing and connection of components in semiconductor packages. - Enhanced performance and reliability of electronic devices. - Improved design and functionality of semiconductor packages.
Benefits: - Optimal layout and connectivity of components. - Enhanced performance and reliability of electronic devices. - Improved overall design and functionality of semiconductor packages.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers to enhance the performance of their electronic devices. - It can also benefit companies producing consumer electronics by improving the design and functionality of their products.
Questions about the technology: 1. How does the floating structure in the semiconductor package improve the overall performance of electronic devices? 2. What specific advantages do passive elements mounted on connection pads without external terminals provide in semiconductor packaging?
Original Abstract Submitted
A semiconductor package comprises: a first package substrate; a semiconductor device mounted on a first surface of the first package substrate and connected to the first package substrate; a plurality of connection pads on a second surface of the first package substrate; a plurality of external connection terminals respectively disposed on one or more connection pads of the plurality of connection pads; a plurality of passive elements mounted on one or more connection pads of the plurality of connection pads in which the plurality of external connection terminals are not disposed; and a floating structure disposed between at least one passive element from the plurality of passive elements and at least one external connection terminal from the plurality of external connection terminals, spaced apart from the at least one passive element and the at least one external connection terminal, and disposed on the second surface of the first package substrate.
