18735409. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hwanpil Park of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18735409 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a package substrate, an interposer, a semiconductor chip, conductive connectors, and a capacitor stack structure.
- The package substrate, interposer, and semiconductor chip are all components of the semiconductor package.
- The conductive connectors facilitate the electrical connection between the package substrate and the interposer.
- The capacitor stack structure includes a first capacitor connected to the package substrate and a second capacitor connected to the interposer.
Potential Applications: This technology can be used in various electronic devices that require high-performance semiconductor packages, such as smartphones, tablets, and laptops.
Problems Solved: This technology addresses the need for efficient and reliable electrical connections in semiconductor packages, as well as the need for effective capacitor structures to support the operation of semiconductor chips.
Benefits: The semiconductor package with the described capacitor stack structure offers improved electrical performance, reliability, and efficiency compared to traditional semiconductor packages.
Commercial Applications: This technology has significant commercial potential in the consumer electronics industry, where high-performance semiconductor packages are in demand for a wide range of devices.
Questions about Semiconductor Package with Capacitor Stack Structure: 1. How does the capacitor stack structure improve the performance of the semiconductor package? 2. What are the specific advantages of using conductive connectors in this semiconductor package design?
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, the capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.
