18441327. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Juneyoung Park of Suwon-si (KR)
Heonjong Shin of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18441327 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes multiple source/drain patterns in an active device layer, insulating layers, a back end of line (BEOL) structure for supplying power, an intermediate layer, and power vias connecting the BEOL structure and the active device layer.
- The semiconductor device features a complex structure with various layers and components.
- Power vias penetrate through the layers to provide electrical connections between the BEOL structure and the active device layer.
- The power vias have a part in each insulating layer and are in contact with the intermediate layer.
- This design allows for efficient power supply to the active device layer while maintaining proper insulation and connectivity.
Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices. - It can be used in various electronic devices that require high-performance and reliable power supply.
Problems Solved: - Provides a solution for efficient power distribution in complex semiconductor devices. - Ensures proper electrical connections while maintaining insulation between layers.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced power supply capabilities in advanced electronic systems.
Commercial Applications: Title: Advanced Semiconductor Devices with Efficient Power Distribution This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and IoT devices. It can also benefit industries that require cutting-edge semiconductor technology for their products.
Questions about Semiconductor Device with Power Vias: 1. How does the power via design improve the efficiency of power distribution in the semiconductor device? - The power via design allows for direct electrical connections between the BEOL structure and the active device layer, ensuring efficient power supply without compromising insulation. 2. What are the potential challenges in implementing power vias in semiconductor devices, and how are they addressed? - One potential challenge could be ensuring the proper alignment and connection of the power vias through multiple layers, which may require precise manufacturing processes and quality control measures.
Original Abstract Submitted
Provided is a semiconductor device including an active device layer including a plurality of source/drain patterns, a plurality of insulating layers on the active device layer, a back end of line (BEOL) structure on the plurality of insulating layers and configured to supply electric power to the active device layer, an intermediate layer between the plurality of insulating layers and the BEOL structure, and at least one power via penetrating through the intermediate layer and at least a part in each of the plurality of insulating layers in a vertical direction. The at least one power via electrically connects the BEOL structure and the active device layer. At least a part of a side surface of the at least one power via is in contact with the intermediate layer.
