18379286. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAE CHOON Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18379286 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a redistribution layer structure, a semiconductor structure, and at least one heat dissipation structure. The heat dissipation structure may consist of a first epoxy molding compound with higher thermal conductivity than a second epoxy molding compound used in the molding material.
- The semiconductor package features a redistribution layer structure.
- A semiconductor structure is positioned on the redistribution layer structure.
- At least one heat dissipation structure is included on the semiconductor structure.
- The heat dissipation structure may contain a first epoxy molding compound.
- The molding material used in the package includes a second epoxy molding compound.
- The first epoxy molding compound has higher thermal conductivity than the second epoxy molding compound.
Potential Applications: - Electronic devices requiring efficient heat dissipation. - Semiconductor manufacturing industry for improved thermal management.
Problems Solved: - Enhanced thermal conductivity in semiconductor packages. - Improved heat dissipation capabilities.
Benefits: - Better performance and reliability of electronic devices. - Increased lifespan of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Packaging for Enhanced Thermal Management This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics, where efficient heat dissipation is crucial for optimal operation.
Questions about Semiconductor Package with Enhanced Thermal Management: 1. How does the use of different epoxy molding compounds impact the thermal conductivity of the semiconductor package? 2. What are the potential implications of this technology on the semiconductor manufacturing industry?
Original Abstract Submitted
A semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for molding the semiconductor structure and the at least one heat dissipation structure, on the redistribution layer structure, where the molding material may include a second epoxy molding compound, where the first epoxy molding compound may have higher thermal conductivity than the second epoxy molding compound.
