18387682. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seunghun Shin of Suwon-si (KR)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18387682 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a first semiconductor chip with two surfaces, a second semiconductor chip stacked on the first surface of the first chip, and a molding layer that contacts the first surface of the first chip and the sidewall of the second chip.
- The molding layer includes a first sidewall from the lower end of the first chip to a first height in a perpendicular direction to the first surface, a second sidewall from the first height to a second height in the same direction, and a flat surface extending from the first height in a parallel direction to the first surface of the first chip.
- This design allows for efficient stacking of semiconductor chips while providing structural support and protection through the molding layer.
- The specific configuration of the molding layer ensures proper alignment and stability of the stacked chips.
- The flat surface of the molding layer helps in maintaining a uniform and secure connection between the chips.
- Overall, this semiconductor package design enhances the performance and reliability of stacked semiconductor chips.
Potential Applications: - This technology can be applied in various electronic devices requiring stacked semiconductor chips, such as smartphones, tablets, and laptops. - It can also be used in industrial applications where compact and reliable semiconductor packaging is essential.
Problems Solved: - Provides structural support and protection for stacked semiconductor chips. - Ensures proper alignment and stability of the chips. - Enhances performance and reliability of semiconductor packages.
Benefits: - Improved efficiency in stacking semiconductor chips. - Enhanced structural integrity and protection. - Increased performance and reliability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry for manufacturing smartphones, tablets, and laptops with improved performance and reliability. It can also find applications in industrial settings where compact and reliable semiconductor packaging is required.
Questions about Semiconductor Package Technology: 1. How does the design of the molding layer contribute to the stability of stacked semiconductor chips? 2. What are the potential benefits of using this semiconductor packaging technology in electronic devices?
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip including a first surface and a second surface opposite to the first surface, a second semiconductor chip stacked on the first surface of the first semiconductor chip, and a molding layer contacting the first surface of the first semiconductor chip and a sidewall of the second semiconductor chip. The molding layer includes a first sidewall from a lower end of the first semiconductor chip to a first height in a first direction perpendicular to the first surface of the first semiconductor chip, a second sidewall from the first height to a second height in the first direction, and a flat surface that extends from the first height in a second direction that is parallel with the first surface of the first semiconductor chip.
