18611499. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Junghoon Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18611499 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a printed circuit board with a cavity, an optical waveguide, a first semiconductor chip with a photonic integrated circuit, an interposer, and a second semiconductor chip.
- The package features a cavity in the printed circuit board, allowing for the integration of optical components.
- An optical waveguide extends onto the cavity, facilitating the transmission of optical signals.
- The first semiconductor chip is positioned inside the cavity and includes a photonic integrated circuit that overlaps with the optical waveguide.
- An interposer is placed on the first semiconductor chip, providing additional functionality and connectivity.
- A second semiconductor chip is mounted on the interposer, enhancing the overall performance of the package.
Potential Applications: - Data communication systems - Optical networking equipment - High-speed computing devices
Problems Solved: - Improved integration of optical and semiconductor components - Enhanced signal transmission efficiency - Increased functionality in a compact form factor
Benefits: - Higher data transfer speeds - Reduced signal loss - Enhanced overall system performance
Commercial Applications: Title: Advanced Optical Semiconductor Package for High-Speed Data Communication Systems This technology can be utilized in data centers, telecommunications infrastructure, and high-performance computing systems to improve data transmission speeds and efficiency.
Questions about the technology: 1. How does the integration of optical waveguides improve signal transmission in the semiconductor package? 2. What are the potential cost savings associated with using this advanced packaging technology in data communication systems?
Frequently Updated Research: Researchers are continually exploring ways to enhance the performance and efficiency of photonic integrated circuits in semiconductor packages. Stay updated on the latest advancements in this field to leverage the full potential of this technology.
Original Abstract Submitted
Provided is a semiconductor package including a printed circuit board including a cavity extending inward from an upper surface thereof, an optical waveguide extending onto the cavity along the upper surface of the printed circuit board, a first semiconductor chip positioned inside the cavity and including a photonic integrated circuit overlapping a portion of the optical waveguide in a vertical direction, an interposer on the first semiconductor chip, and a second semiconductor chip on the interposer.
