HEAD SUSPENSION ASSEMBLY AND DISK DEVICE

Organization Name

Inventor(s)

HEAD SUSPENSION ASSEMBLY AND DISK DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321299 titled 'HEAD SUSPENSION ASSEMBLY AND DISK DEVICE

The patent application describes a head suspension assembly with a support plate, wiring member, and magnetic head mounted on the wiring member.

The magnetic head consists of a slider, head element, connection pads, and a laser oscillation element.
The wiring member includes first connection terminals bonded to the slider's connection pads and a second connection terminal bonded to the laser oscillation element's connection pad.
A cover layer on the wiring member covers part of the non-bonding surface of the second connection terminal.

Potential Applications:

Data storage devices
Magnetic recording systems

Problems Solved:

Improved data read/write capabilities
Enhanced performance of magnetic heads

Benefits:

Higher data transfer speeds
Increased data storage capacity

Commercial Applications:

Manufacturers of hard drives and other data storage devices could benefit from this technology.

Questions about the Technology: 1. How does this head suspension assembly improve data storage devices? 2. What are the specific advantages of using a magnetic head with a laser oscillation element?

Frequently Updated Research: Research on improving data storage technologies and magnetic head performance may be relevant to this technology.

Original Abstract Submitted

according to one embodiment, a head suspension assembly includes a support plate, a wiring member on the support plate, and a magnetic head mounted on the wiring member. the magnetic head includes a slider, a head element, connection pads, and a laser oscillation element on the slider. the wiring member includes a plurality of first connection terminals each having a bonding surface bonded to a connection pad of the slider and a second connection terminal including a bonding surface bonded to a connection pad of the laser oscillation element and a non-bonding surface opposite to the bonding surface. the wiring member includes a cover layer covering at least a part of the non-bonding surface of the second connection terminal.