Qualcomm incorporated (20240321763). PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract
Contents
PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS
Organization Name
Inventor(s)
Hong Bok We of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Michelle Yejin Kim of Carlsbad CA (US)
PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321763 titled 'PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS
The abstract describes a package that includes a substrate with integrated devices. The substrate consists of two core portions, each containing a core layer with a cavity, an integrated device within the cavity, and a dielectric layer encapsulating the device.
- The package comprises a substrate with integrated devices.
- The substrate has two core portions, each with a core layer, cavity, integrated device, and dielectric layer.
- The integrated devices are located within the cavities of the core layers.
Potential Applications: - This technology could be used in electronic devices such as smartphones, tablets, and laptops. - It may find applications in the automotive industry for sensors and control systems. - Medical devices could benefit from this technology for monitoring and diagnostic purposes.
Problems Solved: - Provides a compact and efficient way to integrate devices into a substrate. - Ensures proper encapsulation and protection of the integrated devices. - Facilitates the manufacturing process by streamlining the integration of components.
Benefits: - Improved device performance and reliability. - Space-saving design for compact electronic devices. - Enhanced durability and protection for integrated devices.
Commercial Applications: Title: Advanced Integrated Device Substrate Technology for Electronics Industry This technology can be commercially utilized in the consumer electronics market, automotive sector, and medical device industry. It offers a competitive edge by enhancing device performance, reliability, and compactness.
Questions about Integrated Device Substrate Technology: 1. How does this technology compare to traditional methods of integrating devices into substrates? This technology offers a more efficient and compact solution compared to traditional methods, improving device performance and reliability.
2. What are the potential cost implications of implementing this integrated device substrate technology? The initial investment in implementing this technology may be higher, but the long-term benefits in terms of device performance and reliability can outweigh the costs.
Original Abstract Submitted
a package comprising a substrate and an integrated device coupled to the substrate. the substrate includes (i) a first cored substrate portion comprising a first core layer comprising a first cavity, a first integrated device located in the first cavity of the first core layer, and a first dielectric layer encapsulating the first integrated device; and (ii) a second cored substrate portion comprising a second core layer comprising a second cavity, a second integrated device located in the second cavity of the second core layer and a second dielectric layer encapsulating the second integrated device.
