Qualcomm incorporated (20240321724). METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER simplified abstract
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER
Organization Name
Inventor(s)
Changhan Hobie Yun of San Diego CA (US)
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321724 titled 'METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER
Simplified Explanation: The patent application describes a device with a passive substrate containing metallization layers and interconnects for forming passive components.
- The device includes a passive substrate with a first metallization layer on one surface.
- The first metallization layer consists of a passive component and a plate portion.
- An insulator layer is connected to the plate portion, and a conductive interconnect is attached to the insulator layer.
- The conductive interconnect forms a second passive component linked to the first passive component.
- A laminate substrate is also connected to the first conductive interconnect.
Key Features and Innovation:
- Integration of passive components within a device.
- Use of metallization layers and interconnects for component coupling.
- Incorporation of insulator layers for electrical isolation.
- Utilization of laminate substrates for structural support.
Potential Applications: The technology can be applied in electronic circuits, sensors, and communication devices.
Problems Solved: The device addresses the need for compact and efficient passive component integration in electronic systems.
Benefits:
- Enhanced functionality and performance of electronic devices.
- Reduction in size and weight of components.
- Improved reliability and durability of passive components.
Commercial Applications: The technology can be utilized in the manufacturing of smartphones, IoT devices, and automotive electronics.
Prior Art: Readers can explore prior patents related to passive component integration in electronic devices.
Frequently Updated Research: Stay updated on advancements in passive component integration and miniaturization in electronic systems.
Questions about Passive Component Integration: 1. How does the device improve the efficiency of electronic circuits? 2. What are the potential challenges in scaling up this technology for mass production?
Original Abstract Submitted
a device includes a passive substrate having a first metallization layer on a first surface of the passive substrate. the first metallization layer is composed of a first passive component and a first plate portion. the device includes an insulator layer coupled to the first plate portion of the first metallization layer. the device also includes a first conductive interconnect coupled to the insulator layer to form a second passive component coupled to the first passive component. the device further includes a laminate substrate coupled to the first conductive interconnect.
